CAPACITOR TANT 33UF 16V 20% SMD

T491D336M016AT

Manufacturer Part NumberT491D336M016AT
DescriptionCAPACITOR TANT 33UF 16V 20% SMD
ManufacturerKemet
SeriesT491
TypeMolded
T491D336M016AT datasheet
 


Specifications of T491D336M016AT

Capacitance33µFVoltage - Rated16V
Tolerance±20%Esr (equivalent Series Resistance)800.0 mOhm
Operating Temperature-55°C ~ 125°CMounting TypeSurface Mount
Package / Case2917 (7343 Metric)Size / Dimension0.287" L x 0.169" W (7.30mm x 4.30mm)
Height0.110" (2.80mm)Manufacturer Size CodeD
FeaturesGeneral PurposeVoltage Rating16 Volts
Esr0.8 OhmsOperating Temperature Range- 55 C to + 125 C
Mfr Case CodeD CaseDimensions4.3 mm W x 7.3 mm L x 2.8 mm H
Leakage Current5.3 uAmpsProductTantalum Solid Standard Grade - Other Various
Termination StyleSMD/SMTLead Free Status / RoHS StatusLead free / RoHS Compliant
Lead Spacing-Other names399-3789-2
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Standard MnO
Tantalum Surface Mount Capacitors – T491 Industrial Grade MnO
2
Soldering Process
KEMET’s families of surface mount tantalum capacitors are
compatible with wave (single or dual), convection, IR or vapor
phase reflow techniques. Preheating of these components
is recommended to avoid extreme thermal stress. KEMET's
recommended profile conditions for convection and IR reflow reflect
the profile conditions of the IPC/J-STD-020D standard for moisture
sensitivety testing. The devices can safely withstand a maximum of
three reflow passes at these conditions.
Note that although the X/7343-43 case size can withstand wave
soldering, the tall profile (4.3mm maximum) dictates care in wave
process development.
Profile Feature
Sn-Pb Assembly
Preheat/Soak
Temperature Min (T
)
100°C
Smin
Temperature Max (T
)
150°C
Smax
Time (t
) from T
to T
)
60-120 sec
s
smin
smax
Ramp-up rate (T
to T
)
3°C/sec max
L
P
Liquidous temperature (T
)
183°C
L
Time above liquidous (t
)
60-150 sec
L
220°C*
Peak Temperature (T
)
235°C**
P
Time within 5°C of max peak
20 sec max
temperature (t
)
P
Ramp-down rate (T
to T
)
6°C/sec max
P
L
Time 25°C to peak temperature
6 minutes max
Note 1: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly reflow.
* Case Size D, E, P, Y and X
**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W and Z
Construction
MNO
/Ta
O
/Ta
2
2
5
Silver Paint
Leadframe
(-Cathode)
Carbon
Tantalum Wire
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
Series
2
T
P
T
L
T
smax
T
smin
25
Pb-Free Assembly
150°C
200°C
60-120 sec
3°C/sec max
217°C
60-150 sec
250°C*
260°C**
30 sec max
6°C/sec max
8 minutes max
Silver Adhesive
Washer
Leadframe
(+Anode)
Weld
t
Max Ramp Up Rate = 3 ° C/sec
Max Ramp Down Rate = 6 ° C/sec
t
L
t
S
25° C to Peak
Time
Time/Temperature Soldering Profile
T2005-1 • 1/17/2011
P
16 16