IRF9520NS International Rectifier, IRF9520NS Datasheet

MOSFET P-CH 100V 6.8A D2PAK

IRF9520NS

Manufacturer Part Number
IRF9520NS
Description
MOSFET P-CH 100V 6.8A D2PAK
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of IRF9520NS

Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
480 mOhm @ 4A, 10V
Drain To Source Voltage (vdss)
100V
Current - Continuous Drain (id) @ 25° C
6.8A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
27nC @ 10V
Input Capacitance (ciss) @ Vds
350pF @ 25V
Power - Max
3.8W
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (2 leads + tab)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
*IRF9520NS

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRF9520NS
Manufacturer:
IR
Quantity:
20 000
Company:
Part Number:
IRF9520NSTRL
Quantity:
10 000
Description
Absolute Maximum Ratings
Thermal Resistance
Fifth Generation HEXFETs from International Rectifier utilize
advanced processing techniques to achieve extremely low
on-resistance per silicon area. This benefit, combined with
the fast switching speed and ruggedized device design that
HEXFET Power MOSFETs are well known for, provides the
designer with an extremely efficient and reliable device for
use in a wide variety of applications.
The D
accommodating die sizes up to HEX-4. It provides the highest
power capability and the lowest possible on-resistance in
any existing surface mount package. The D
for high current applications because of its low internal
connection resistance and can dissipate up to 2.0W in a
typical surface mount application.
The through-hole version (IRF9520L) is available for low-
profile applications.
I
I
I
P
P
V
E
I
E
dv/dt
T
T
R
R
AR
D
D
DM
AS
AR
J
STG
D
D
GS
JA
@ T
@ T
JC
@T
@T
Advanced Process Technology
Surface Mount (IRF9520S)
Low-profile through-hole (IRF9520L)
175°C Operating Temperature
Fast Switching
P-Channel
Fully Avalanche Rated
2
C
C
Pak is a surface mount power package capable of
A
C
= 25°C
= 25°C
= 100°C
= 25°C
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Power Dissipation
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Junction-to-Case
Junction-to-Ambient ( PCB Mounted,steady-state)**
Parameter
Parameter
2
Pak is suitable
GS
GS
@ -10V
@ -10V
G
300 (1.6mm from case )
Typ.
–––
–––
D Pak
IRF9520NS/L
HEXFET
2
-55 to + 175
D
S
Max.
0.32
-6.8
-4.8
-4.0
-5.0
± 20
140
-27
3.8
4.8
48
®
R
Power MOSFET
T O -26 2
V
DS(on)
Max.
DSS
3.1
40
I
D
= -6.8A
= -100V
PD -91522A
= 0.48
Units
Units
W/°C
°C/W
V/ns
mJ
mJ
°C
W
W
A
V
A
5/13/98

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IRF9520NS Summary of contents

Page 1

... T Operating Junction and J T Storage Temperature Range STG Soldering Temperature, for 10 seconds Thermal Resistance Parameter R Junction-to-Case JC R Junction-to-Ambient ( PCB Mounted,steady-state)** JA IRF9520NS/L HEXFET G D Pak 2 Pak is suitable @ -10V GS @ -10V GS 300 (1.6mm from case ) Typ. ––– ––– PD -91522A ® ...

Page 2

... IRF9520NS/L Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward Leakage I GSS Gate-to-Source Reverse Leakage Q Total Gate Charge g Q Gate-to-Source Charge ...

Page 3

... Fig 2. Typical Output Characteristics, 2.5 -6. 2.0 ° 1 ° J 1.0 0.5 0 -60 -40 -20 0 Fig 4. Normalized On-Resistance IRF9520NS/L VGS -15V -10V -8.0V -7.0V -6.0V -5.5V -5.0V -4.5V -4.5V 20µs PULSE WIDTH ° 175 Drain-to-Source Voltage ( -10V 100 120 140 160 180 ° ...

Page 4

... IRF9520NS/L 800 1MHz iss rss oss ds gd 600 C iss 400 C oss C rss 200 Drain-to-Source Voltage (V) DS Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage 100 ° 175 0.1 0.2 0.8 1.4 -V ,Source-to-Drain Voltage (V) SD Fig 7. Typical Source-Drain Diode Forward Voltage SHORTED 100 100 10 ° ...

Page 5

... Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case -10V Pulse Width Duty Factor Fig 10a. Switching Time Test Circuit t d(on 10% 150 175 ° 90 Fig 10b. Switching Time Waveforms Notes: 1. Duty factor Peak 0.001 0. Rectangular Pulse Duration (sec) 1 IRF9520NS D.U. µ d(off ...

Page 6

... IRF9520NS Fig 12a. Unclamped Inductive Test Circuit Fig 12b. Unclamped Inductive Waveforms Q G -10V Charge Fig 13a. Basic Gate Charge Waveform 400 300 A 200 15V 100 0 25 Starting T , Junction Temperature ( C) Fig 12c. Maximum Avalanche Energy (BR)DSS 12V V Fig 13b. Gate Charge Test Circuit ...

Page 7

... D.U.T. V Waveform DS Re-Applied Voltage Body Diode Inductor Curent Ripple *** V = 5.0V for Logic Level and 3V Drive Devices GS Fig 14. For P-Channel HEXFETS IRF9520NS/L Circuit Layout Considerations Low Stray Inductance Ground Plane Low Leakage Inductance Current Transformer - + dv/dt controlled controlled by Duty Factor "D" SD D.U.T. - Device Under Test P ...

Page 8

... IRF9520NS Pak Package Outline 1 0.54 (.4 15) 1 0.29 (.4 05) 1.4 0 (.055 ) - AX. 2 1 (.6 10) 1 (.5 80 1.40 (.0 55) 3X 1.14 (.0 45) 0 .93 (. .69 (. .08 (. .25 (. FTER IP & 4.5M , 198 TRO L LIN SIO ATSINK & Part Marking Information 2 D Pak TIO 4.69 (.1 85) 4.20 (.1 65) 1 ...

Page 9

... Package Outline TO-262 Outline Part Marking Information TO-262 IRF9520NS/L ...

Page 10

... IRF9520NS/L Tape & Reel Information 2 D Pak IRE CTIO (. (. IRE CTIO (14.1 73 IA-4 18 LIM WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331 EUROPEAN HEADQUARTERS: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel 1883 732020 IR CANADA: 7321 Victoria Park Ave., Suite 201, Markham, Ontario L3R 2Z8, Tel: (905) 475 1897 IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel 6172 96590 IR FAR EAST: K& ...

Page 11

Note: For the most current drawings please refer to the IR website at: http://www.irf.com/package/ ...

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