IRFR210TR Vishay, IRFR210TR Datasheet

MOSFET N-CH 200V 2.6A DPAK

IRFR210TR

Manufacturer Part Number
IRFR210TR
Description
MOSFET N-CH 200V 2.6A DPAK
Manufacturer
Vishay
Datasheet

Specifications of IRFR210TR

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
1.5 Ohm @ 1.6A, 10V
Drain To Source Voltage (vdss)
200V
Current - Continuous Drain (id) @ 25° C
2.6A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
8.2nC @ 10V
Input Capacitance (ciss) @ Vds
140pF @ 25V
Power - Max
2.5W
Mounting Type
Surface Mount
Package / Case
DPak, TO-252 (2 leads+tab), SC-63
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
1.5 Ohms
Drain-source Breakdown Voltage
200 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
2.6 A
Power Dissipation
2.5 W
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRFR210TR
Manufacturer:
IR
Quantity:
20 000
Part Number:
IRFR210TRPBF
Manufacturer:
MAX
Quantity:
98
Part Number:
IRFR210TRPBF
Manufacturer:
VISHAY
Quantity:
220
Part Number:
IRFR210TRPBF
Manufacturer:
VISHAY/威世
Quantity:
20 000
Company:
Part Number:
IRFR210TRPBF
Quantity:
22 000
Company:
Part Number:
IRFR210TRPBF
Quantity:
15 045
Note
a. See device orientation.
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V
c. I
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material).
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91268
S-82987-Rev. B, 19-Jan-09
PRODUCT SUMMARY
V
R
Q
Q
Q
Configuration
ORDERING INFORMATION
Package
Lead (Pb)-free
SnPb
ABSOLUTE MAXIMUM RATINGS T
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
Linear Derating Factor
Linear Derating Factor (PCB Mount)
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Maximum Power Dissipation
Maximum Power Dissipation (PCB Mount)
Peak Diode Recovery dV/dt
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
DS
DS(on)
g
gs
gd
SD
(TO-252)
D
DD
(Max.) (nC)
DPAK
(nC)
(nC)
(V)
≤ 2.6 A, dI/dt ≤ 70 A/µs, V
= 50 V, starting T
(Ω)
G
S
D
(TO-251)
IPAK
a
a
J
DPAK (TO-252)
IRFR210PbF
SiHFR210-E3
IRFR210
SiHFR210
= 25 °C, L = 28 mH, R
G
c
a
D S
DD
b
V
≤ V
GS
e
= 10 V
DS
G
, T
N-Channel MOSFET
J
e
Single
≤ 150 °C.
200
8.2
1.8
4.5
G
DPAK (TO-252)
IRFR210TRLPbF
SiHFR210TL-E3
IRFR210TRL
SiHFR210TL
= 25 Ω, I
D
S
C
Power MOSFET
= 25 °C, unless otherwise noted
V
IRFR210, IRFU210, SiHFR210, SiHFU210
1.5
GS
AS
at 10 V
= 2.6 A (see fig. 12).
a
a
T
T
for 10 s
C
A
a
a
= 25 °C
= 25 °C
T
T
C
C
DPAK (TO-252)
IRFR210TRPbF
SiHFR210T-E3
IRFR210TR
SiHFR210T
= 100 °C
= 25 °C
FEATURES
• Dynamic dV/dt Rating
• Repetitive Avalanche Rated
• Surface Mount (IRFR210/SiHFR210)
• Straight Lead (IRFU210/SiHFU210)
• Available in Tape and Reel
• Fast Switching
• Ease of Paralleling
• Lead (Pb)-free Available
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized
cost-effectiveness.
The DPAK is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight
lead version (IRFU/SiHFU series) is for through-hole
mounting applications. Power dissipation levels up to 1.5 W
are possible in typical surface mount applications.
a
a
SYMBOL
T
a
a
dV/dt
J
V
V
E
E
I
I
P
, T
device
I
DM
AR
DS
GS
AS
AR
D
D
stg
DPAK (TO-252)
-
-
IRFR210TRR
SiHFR210TR
design,
- 55 to + 150
a
a
LIMIT
0.020
260
± 20
0.20
200
130
2.6
1.7
2.7
2.5
2.5
5.0
10
25
low
d
Vishay Siliconix
on-resistance
IPAK (TO-251)
IRFU210PbF
SiHFU210-E3
IRFU210
SiHFU210
www.vishay.com
UNIT
W/°C
V/ns
RoHS*
COMPLIANT
mJ
mJ
°C
W
V
A
A
Available
and
1

Related parts for IRFR210TR

IRFR210TR Summary of contents

Page 1

... 100 ° ° °C A for Ω 2.6 A (see fig. 12 ≤ 150 °C. J Vishay Siliconix device design, low on-resistance DPAK (TO-252) IPAK (TO-251 IRFU210PbF a - SiHFU210- IRFR210TRR IRFU210 a a SiHFR210TR SiHFU210 SYMBOL LIMIT V 200 DS V ± 2 1 0.20 0.020 E 130 2.5 dV/dt 5 ...

Page 2

... IRFR210, IRFU210, SiHFR210, SiHFU210 Vishay Siliconix THERMAL RESISTANCE RATINGS PARAMETER Maximum Junction-to-Ambient Maximum Junction-to-Ambient a (PCB Mount) Maximum Junction-to-Case (Drain) Note a. When mounted on 1" square PCB (FR-4 or G-10 material). SPECIFICATIONS °C, unless otherwise noted J PARAMETER Static Drain-Source Breakdown Voltage V Temperature Coefficient DS Gate-Source Threshold Voltage ...

Page 3

... TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted Fig Typical Output Characteristics, T Fig Typical Output Characteristics, T Document Number: 91268 S-82987-Rev. B, 19-Jan-09 IRFR210, IRFU210, SiHFR210, SiHFU210 = 25 °C Fig Typical Transfer Characteristics C = 150 °C Fig Normalized On-Resistance vs. Temperature C Vishay Siliconix www.vishay.com 3 ...

Page 4

... IRFR210, IRFU210, SiHFR210, SiHFU210 Vishay Siliconix Fig Typical Capacitance vs. Drain-to-Source Voltage Fig Typical Gate Charge vs. Gate-to-Source Voltage www.vishay.com 4 Fig Typical Source-Drain Diode Forward Voltage Fig Maximum Safe Operating Area Document Number: 91268 S-82987-Rev. B, 19-Jan-09 ...

Page 5

... Fig Maximum Effective Transient Thermal Impedance, Junction-to-Case Document Number: 91268 S-82987-Rev. B, 19-Jan-09 IRFR210, IRFU210, SiHFR210, SiHFU210 Pulse width ≤ 1 µs Duty factor ≤ 0.1 % Fig. 10a - Switching Time Test Circuit d(on) Fig. 10b - Switching Time Waveforms Vishay Siliconix D.U. d(off) f www.vishay.com 5 ...

Page 6

... IRFR210, IRFU210, SiHFR210, SiHFU210 Vishay Siliconix Vary t to obtain p required I AS D.U 0.01 Ω Fig. 12a - Unclamped Inductive Test Circuit Charge Fig. 13a - Basic Gate Charge Waveform www.vishay.com Fig. 12b - Unclamped Inductive Waveforms Fig. 12c - Maximum Avalanche Energy vs. Drain Current V DS ...

Page 7

... V GS Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see www.vishay.com/ppg?91268. Document Number: 91268 S-82987-Rev ...

Page 8

... Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’ ...

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