ESDALC6V1M3 STMicroelectronics, ESDALC6V1M3 Datasheet

TRANSIL ARRAY ESD PROT SOT883

ESDALC6V1M3

Manufacturer Part Number
ESDALC6V1M3
Description
TRANSIL ARRAY ESD PROT SOT883
Manufacturer
STMicroelectronics
Series
TRANSIL™r
Datasheet

Specifications of ESDALC6V1M3

Voltage - Reverse Standoff (typ)
5V
Voltage - Breakdown
6.1V
Polarization
2 Channel Array - Unidirectional
Mounting Type
Surface Mount
Package / Case
SC-101, SOT-883
Polarity
Unidirectional
Operating Voltage
5 V
Breakdown Voltage
6.1 V
Termination Style
SMD/SMT
Peak Surge Current
3 A
Peak Pulse Power Dissipation
30 W
Capacitance
11 pF
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Dimensions
0.6 mm W x 1 mm L
Suppressor Type
TVS
Esd Protection Voltage
±15KV@Air Gap/±11KV@Contact Disc
Direction Type
Uni-Directional
Configuration
Dual
Mounting Style
Surface Mount
Leakage Current (max)
0.5uA
Capacitance Value
11pF
Operating Temperature Min Deg. C
-40C
Operating Temperature Max Deg. C
125C
Product Length (mm)
1mm
Product Depth (mm)
0.6mm
Product Height (mm)
0.47mm
Pin Count
3
Rad Hardened
No
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power (watts)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-5563-2
ESDALC6V1M3

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Features
Benefits
Complies with the following standards
Applications
Where transient overvoltage protection in ESD
sensitive equipment is required, such as:
October 2010
2 unidirectional, low capacitance Transil diodes
Better than IEC 61000-4-2 standard (ESD
protection: 11 kV contact discharge)
Breakdown voltage V
Low diode capacitance (11 pF typ at 0 V)
Low leakage current < 0.5 µA
Very small PCB area: 0.6 mm
RoHS compliant
High ESD protection level
High integration
Suitable for high density boards
IEC61000-4-2 level 4:
– 15 kV (air discharge)
– 8 kV (contact discharge)
MIL STD 883G-Method 3015-7: class 3B:
– HBM (human body model)
Computers
Printers
Communication systems
Cellular phone handsets and accessories
Video equipment
Dual low capacitance Transil™ array for ESD protection
BR
= 6.1 V min
2
Doc ID 11555 Rev 5
Figure 1.
Description
The ESDALC6V1M3 is a monolithic array
designed to protect 1 line or 2 lines against ESD
transients.
The device is ideal for applications where both
reduced line capacitance and board space saving
are required.
TM: Transil is a trademark of STMicroelectronics
Functional diagram
I/O2
(JEDEC MO-236AA)
Underside view
ESDALC6V1M3
1
2
SOT883
GND
GND
GND
GND
3
3
2 2
2 1
I/O1
www.st.com
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ESDALC6V1M3 Summary of contents

Page 1

... Cellular phone handsets and accessories ■ Video equipment October 2010 2 Figure 1. Description The ESDALC6V1M3 is a monolithic array designed to protect 1 line or 2 lines against ESD transients. The device is ideal for applications where both reduced line capacitance and board space saving are required. TM: Transil is a trademark of STMicroelectronics ...

Page 2

... Breakdown voltage Leakage current @ V RM Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Breakdown current Voltage temperature coefficient Forward voltage drop = 25 °C) amb Test condition = 30 mV OSC Doc ID 11555 Rev 5 ESDALC6V1M3 Value ± 15 ± initial = amb 3 -40 + 125 -55 + 150 260 ...

Page 3

... ESDALC6V1M3 Figure 3. Relative variation of peak pulse power versus initial junction temperature 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0 (°C) 0 Figure 5. Clamping voltage versus peak pulse current (typical values) I (A) PP 10.0 8/20 µ °C initial 1.0 0 Figure 7. Junction capacitance versus ...

Page 4

... Figure 12. Analog crosstalk measurements 0.00 0.00 - 30.00 - 30.00 - 60.00 - 60.00 - 90.00 - 90.00 - 120.00 - 120.00 100.0M 100.0M 1.0G 1.0G Doc ID 11555 Rev 5 ESDALC6V1M3 (-15 kV air discharge) on each channel between channels dB F (Hz) 100.0k 100.0k 1.0M 1.0M 10.0M 10.0M 100.0M 100.0M Xtalk Xtalk 1.0G ...

Page 5

... ESDALC6V1M3 2 Ordering information Figure 13. Ordering information scheme ESD array Low capacitance Breakdown voltage 6V1 = 6.1 Volts min. Package M3 = SOT883 Doc ID 11555 Rev 5 Ordering information ESDA LC 6V1 M3 5/12 ...

Page 6

... Figure 14. Footprint 0.40 0.20 0.25 6/12 Ref Figure 15. Marking 0.40 0.70 0.30 All dimensions in mm Doc ID 11555 Rev 5 ESDALC6V1M3 Dimensions Millimeters Min. Typ. Max. Min. A 0.40 0.50 0.016 A1 0.00 0.05 0.00 b1 0.10 0.15 0.20 0.004 0.006 0.007 b2 0.45 0.50 0.55 0.018 0.020 0.021 D 0 ...

Page 7

... ESDALC6V1M3 Figure 16. Packing information 0.20 All dimensions in mm Cathode bar 2.0 0.6 0.68 User direction of unreeling Doc ID 11555 Rev 5 Package information Ø 1.55 4.0 2.0 7/12 ...

Page 8

... Stencil opening for leads: Opening to footprint ratio 90%. Figure 18. Recommended stencil window position 10 µm 10 µm 8/ ---- - = 1 --------------------------- - = 0. 400 µm 7 µm 380 µm 7 µm 10 µm 10 µm 0.20 18 µm 380 µm 18 µm 400 µm Doc ID 11555 Rev 5 ESDALC6V1M3 W T=100 µm 0.4 0.4 0.70 0.25 0.30 Footprint Stencil window Footprint ...

Page 9

... ESDALC6V1M3 4.2 Solder paste 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component movement during high speed. 4. Solder paste with fine particles: powder particle size is 20-45 µm. 4.3 Placement 1. Manual positioning is not recommended. ...

Page 10

... Note: Minimize air convection currents in the reflow oven to avoid component movement. 10/12 3°C/s max 3°C/s max 150 sec 90 to 150 sec Doc ID 11555 Rev 5 ESDALC6V1M3 2°C/s recommended 2°C/s recommended 6°C/s max 6°C/s max Time (min) Time (min) 10-30 sec 10-30 sec ...

Page 11

... ESDALC6V1M3 5 Ordering information Table 4. Ordering information Order code ESDALC6V1M3 1. The marking can be rotated by 90° to differentiate assembly location 6 Revision history Table 5. Document revision history Date 04-Aug-2005 23-May-2006 16-Jun-2006 18-Feb-2007 26-Oct-2010 Marking Package Weight (1) K SOT883 0.86 mg Revision 1 Initial release. Reformated to current standards. Added soldering reflow profile 2 diagram ...

Page 12

... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 12/12 Please Read Carefully: © 2010 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com Doc ID 11555 Rev 5 ESDALC6V1M3 ...

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