ESDALC6V1-1BM2 STMicroelectronics, ESDALC6V1-1BM2 Datasheet - Page 7
![TRANSIL ARRAY ESD PROT SOD882](/photos/10/64/106406/497-sod-882_series_sml.jpg)
ESDALC6V1-1BM2
Manufacturer Part Number
ESDALC6V1-1BM2
Description
TRANSIL ARRAY ESD PROT SOD882
Manufacturer
STMicroelectronics
Series
TRANSIL™r
Specifications of ESDALC6V1-1BM2
Voltage - Reverse Standoff (typ)
3V
Voltage - Breakdown
6.1V
Power (watts)
140W
Polarization
Bidirectional
Mounting Type
Surface Mount
Package / Case
SOD-882
Number Of Elements
1
Polarity
Bi-Directional
Package Type
SOD-882
Operating Temperature Classification
Automotive
Reverse Breakdown Voltage
6.1V
Reverse Stand-off Voltage
3V
Leakage Current (max)
100nA
Peak Pulse Current
9A
Peak Pulse Power Dissipation
140W
Test Current (it)
1mA
Operating Temp Range
-40C to 125C
Mounting
Surface Mount
Pin Count
2
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-5543-2
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ESDALC6V1-1BM2
Manufacturer:
STMicroelectronics
Quantity:
135
Part Number:
ESDALC6V1-1BM2
Manufacturer:
ST
Quantity:
20 000
ESDALC6V1-1BM2
4
4.1
4.2
Recommendation on PCB assembly
Stencil opening design
1.
Figure 15. Stencil opening dimensions
2.
Figure 16. Recommended stencil windows position
Solder paste
1.
2.
3.
4.
General recommendation on stencil opening design
a)
b)
Reference design
a)
b)
Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
“No clean” solder paste is recommended.
Offers a high tack force to resist component movement during high speed
Solder paste with fine particles: powder particle size is 20-45 µm.
Stencil opening dimensions: L (Length), W (Width), T (Thickness).
General design rule
Stencil thickness (T) = 75 ~ 125 µm
Stencil opening thickness: 100 µm
Stencil opening for leads: Opening to footprint ratio - between 60% and 65%.
Aspect Ratio
Aspect Area
Lead footprint on PCB
Stencil window
position
0.45 mm
=
=
W
---- -
--------------------------- -
2T L
T
Doc ID 12891 Rev 3
L
1.5
0.39 mm
+
W
W
0.05 mm
Package footprint
L
0.66
T
W
Recommendation on PCB assembly
0.05 mm
Lead footprint on PCB
Stencil window
position
7/10