ESDALC6V1-1M2 STMicroelectronics, ESDALC6V1-1M2 Datasheet - Page 8

• Manufacturer Part Number: ESDALC6V1-1M2
• Description: TRANSIL ESD PROT LOW CAP SOD-882
• Manufacturer: STMicroelectronics
• Series: TRANSIL™r

Specifications of ESDALC6V1-1M2

• Voltage - Reverse Standoff (typ): 3V
• Voltage - Breakdown: 6.1V
• Power (watts): 50W
• Polarization: Unidirectional
• Mounting Type: Surface Mount
• Package / Case: SOD-882
• Polarity: Unidirectional
• Operating Voltage: 3 V
• Breakdown Voltage: 6.1 V
• Termination Style: SMD/SMT
• Peak Surge Current: 6 A
• Peak Pulse Power Dissipation: 50 W
• Capacitance: 22 pF
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Dimensions: 0.6 mm W x 1 mm L
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-5238-2

Recommendation on PCB assembly
4
4.1
4.2
8/11
Recommendation on PCB assembly
Stencil opening design
1.
Figure 16. Stencil opening dimensions
2.
Figure 17. Recommended stencil windows position
Solder paste
1.
2.
3.
4.
General recommendation on stencil opening design
a)
b)
Reference design
a)
b)
Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
“No clean” solder paste is recommended.
Offers a high tack force to resist component movement during high speed.
Solder paste with fine particles: powder particle size is 20-45 µm.
Stencil opening dimensions: L (Length), W (Width), T (Thickness).
General design rule
Stencil thickness (T) = 75 ~ 125 µm
Stencil opening thickness: 100 µm
Stencil opening for leads: Opening to footprint ratio - between 60% and 65%.
Aspect Ratio
Aspect Area
Lead footprint on PCB
Stencil window
position
0.45 mm
=
=
W
---- -
--------------------------- -
2T L
T
Doc ID 12385 Rev 6
L
1.5
0.39 mm
+
W
W
0.05 mm
0.055 mm
Package footprint
L
0.66
T
W
0.05 mm
Lead footprint on PCB
Stencil window
position
ESDALC6V1-1M2