MAX3208EAUB+ Maxim Integrated Products, MAX3208EAUB+ Datasheet - Page 3

• Manufacturer Part Number: MAX3208EAUB+
• Description: IC ESD PROT DIFF 10-UMAX
• Manufacturer: Maxim Integrated Products
• Type: Diode Arraysr
• Series: MAX3208Er

Specifications of MAX3208EAUB+

• Power (watts): 444mW
• Polarization: 4 Channel Array - Unidirectional
• Mounting Type: Surface Mount
• Package / Case: 10-MSOP, Micro10™, 10-uMAX, 10-uSOP
• Capacitance Value: 10(Typ) pF
• Maximum Clamping Voltage: 105.5 V
• Number Of Elements Per Chip: 4
• Esd Protection Voltage: ±15@HBM|±15@Air Gap|±8@Contact Disc KV
• Maximum Leakage Current: 0.1 uA
• Channels: 4 Channels
• Clamping Voltage: 100 V
• Operating Voltage: - 0.3 V to + 6.0 V
• Termination Style: SMD/SMT
• Capacitance: 2 pF
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Dimensions: 3.05 (Max) mm W x 3.05 (Max) mm L
• Diode Type: ESD Protection
• Power Dissipation Pd: 444mW
• Diode Case Style: µMAX
• No. Of Pins: 10
• Termination Type: SMD
• Capacitance, Cd: 2.6pF
• Operating Temperature Range: -40°C To +125°C
• Rohs Compliant: Yes
• Filter Terminals: SMD
• Esd Threat Voltage Max: 15kV
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Breakdown: -
• Voltage - Reverse Standoff (typ): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

(V
12, 13, 15
TQFN-EP
1, 3, 6, 8,
9, 11, 14,
CC
4, 5, 7,
1.5
1.3
1.1
0.9
0.7
0.5
0.3
16
—
10
—
= +5V, T
2
10
MAX3205E
30
A
A2, A3, B1,
B3, C1, C2
= +25°C, unless otherwise noted.)
50
CLAMP VOLTAGE
vs. DC CURRENT
WLP
DC CURRENT (mA)
C3
B2
A1
—
—
I/O_ TO V
_______________________________________________________________________________________
70
GND TO I/O_
90
CC
MAX3207E
110
SOT23
PIN
1, 4
3, 6
—
—
2
5
130
150
2, 5, 7, 10
Dual, Quad, and Hex High-Speed
1, 4, 6, 9
μMAX
—
—
10,000
3
8
Differential ESD-Protection ICs
1000
100
MAX3208E
10
1
-40
4, 7, 12, 15
13, 14, 16
TQFN-EP
1, 3, 5, 6,
8, 9, 11,
0
—
10
—
2
LEAKAGE CURRENT
vs. TEMPERATURE
TEMPERATURE (°C)
40
NAME
GND
Typical Operating Characteristics
N.C.
N.C.
I/O_
V
EP
CC
80
ESD-Protected Channel
No Connection. Not internally connected.
No Connection. The solder sphere is omitted from
this location (see the Package Information section).
Ground. Connect GND with a low-impedance
connection to the ground plane.
Power-Supply Input. Bypass V
0.1μF ceramic capacitor as close to the device as
possible.
Exposed Pad (TQFN Only). Connect EP to GND.
120
4
3
2
1
0
0
FUNCTION
1
Pin Description
INPUT CAPACITANCE
vs. INPUT VOLTAGE
INPUT VOLTAGE (V)
CC
2
to GND with a
3
4
5
3