PIC16F616-I/P Microchip Technology, PIC16F616-I/P Datasheet - Page 149

IC PIC MCU FLASH 2KX14 14DIP

PIC16F616-I/P

Manufacturer Part Number
PIC16F616-I/P
Description
IC PIC MCU FLASH 2KX14 14DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F616-I/P

Core Size
8-Bit
Program Memory Size
3.5KB (2K x 14)
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Core Processor
PIC
Speed
20MHz
Number Of I /o
11
Program Memory Type
FLASH
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
14-DIP (0.300", 7.62mm)
Controller Family/series
PIC16F
No. Of I/o's
12
Ram Memory Size
128Byte
Cpu Speed
20MHz
No. Of Timers
3
Package
14PDIP
Device Core
PIC
Family Name
PIC16
Maximum Speed
20 MHz
Operating Supply Voltage
2.5|3.3|5 V
Data Bus Width
8 Bit
Number Of Programmable I/os
11
On-chip Adc
8-chx10-bit
Number Of Timers
3
Processor Series
PIC16F
Core
PIC
Data Ram Size
128 B
Maximum Clock Frequency
20 MHz
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
MCP1631RD-DCPC1 - REF DES BATT CHARG OR LED DRIVERAC162083 - HEADER MPLAB ICD2 PIC16F616 8/14AC124001 - MODULE SKT PROMATEII 8DIP/SOIC
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
 Details
15.5
© 2007 Microchip Technology Inc.
DC CHARACTERISTICS
D101*
D101A* C
D130
D130A
D131
D132
D133
D134
Note 1:
Param
No.
2:
3:
4:
*
COSC2
E
E
V
V
T
T
DC Characteristics:
PEW
RETD
P
D
PR
PEW
IO
Sym
These parameters are characterized but not tested.
Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended to use an external
clock in RC mode.
Negative current is defined as current sourced by the pin.
The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent
normal operating conditions. Higher leakage current may be measured at different input voltages.
Including OSC2 in CLKOUT mode.
Capacitive Loading Specs on
Output Pins
OSC2 pin
All I/O pins
Program Flash Memory
Cell Endurance
Cell Endurance
V
V
Erase/Write cycle time
Characteristic Retention
DD
DD
for Read
for Erase/Write
Characteristic
PIC16F610/616/16HV610/616-I (Industrial)
PIC16F610/616/16HV610/616-E (Extended) (Continued)
PIC16F610/616/16HV610/616
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Preliminary
V
Min
10K
4.5
1K
40
MIN
100K
Typ†
10K
2
-40°C ≤ T
-40°C ≤ T
Max
5.5
5.5
2.5
15
50
Units
A
A
Year Provided no other specifications
E/W -40°C ≤ T
E/W +85°C ≤ T
ms
pF
pF
≤ +85°C for industrial
≤ +125°C for extended
V
V
In XT, HS and LP modes when
external clock is used to drive
OSC1
V
voltage
are violated
MIN
= Minimum operating
A
A
Conditions
≤ +85°C
≤ +125°C
DS41288C-page 147

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