PIC16F685-I/P Microchip Technology, PIC16F685-I/P Datasheet - Page 238

• Manufacturer Part Number: PIC16F685-I/P
• Description: IC PIC MCU FLASH 4KX14 20DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F685-I/P

• Program Memory Type: FLASH
• Program Memory Size: 7KB (4K x 14)
• Package / Case: 20-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 18
• Eeprom Size: 256 x 8
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: I2C/SPI/SSP/EUSART
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 17
• Number Of Timers: 3
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163029, DV164120
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC162061 - HEADER INTRFC MPLAB ICD2 20PINAC164039 - MODULE SKT PROMATE II 20DIP/SOICDM163029 - BOARD PICDEM FOR MECHATRONICSACICE0203 - MPLABICE 20P 300 MIL ADAPTER
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC16F631/677/685/687/689/690
17.5
DS41262C-page 236
Standard Operating Conditions (unless otherwise stated)
Operating temperature
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Note 1:
Param
No.
2:
3:
Thermal Considerations
T
PD
P
P
P
I
T
Maximum allowable power dissipation is the lower value of either the absolute maximum total power
dissipation or derated power.
DD
JA
JC
A
DIE
INTERNAL
I
DER
/
O
= Ambient Temperature.
Sym
is current to run the chip alone without driving any load on the output pins.
Thermal Resistance
Junction to Ambient
Thermal Resistance
Junction to Case
Die Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
-40°C
Characteristic
T
A
+125°C
Preliminary
108.1
62.4
85.2
28.1
24.2
32.2
Typ
150
2.5
40
—
—
—
—
Units
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
W
W
W
W
C
20-pin PDIP package
20-pin SOIC package
20-pin SSOP package
20-pin QFN 4x4mm package
20-pin PDIP package
20-pin SOIC package
20-pin SSOP package
20-pin QFN 4x4mm package
For derated power calculations
PD = P
P
(NOTE 1)
P
P
(NOTE 2, 3)
INTERNAL
I
DER
/
O
=
= PD
INTERNAL
(I
OL
= I
MAX
© 2006 Microchip Technology Inc.
* V
DD
Conditions
OL
(T
+ P
x V
) +
DIE
I
DD
/
O
- T
(I
A
OH
)/
* (V
JA
DD
- V
OH
))