PIC16F1936-I/MV Microchip Technology, PIC16F1936-I/MV Datasheet - Page 456
![IC MCU 8BIT 14KB FLASH 28UQFN](/photos/12/13/121305/c04-152_mv_sml.jpg)
PIC16F1936-I/MV
Manufacturer Part Number
PIC16F1936-I/MV
Description
IC MCU 8BIT 14KB FLASH 28UQFN
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr
Datasheets
1.PIC16F722-ISS.pdf
(8 pages)
2.PIC16LF1933-ISS.pdf
(508 pages)
3.PIC16LF1933-ISS.pdf
(46 pages)
4.PIC16F1936-ISS.pdf
(12 pages)
Specifications of PIC16F1936-I/MV
Core Size
8-Bit
Program Memory Size
14KB (8K x 14)
Core Processor
PIC
Speed
32MHz
Connectivity
I²C, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LCD, POR, PWM, WDT
Number Of I /o
25
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-UFQFN Exposed Pad
Controller Family/series
PIC16F
No. Of I/o's
25
Eeprom Memory Size
256Byte
Ram Memory Size
512Byte
Cpu Speed
32MHz
No. Of Timers
5
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
MI2C, SPI, EUSART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
25
Number Of Timers
5
Operating Supply Voltage
1.8 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 11 Channel
On-chip Dac
5 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
- PIC16F722-ISS PDF datasheet
- PIC16LF1933-ISS PDF datasheet #2
- PIC16LF1933-ISS PDF datasheet #3
- PIC16F1936-ISS PDF datasheet #4
- Current page: 456 of 508
- Download datasheet (5Mb)
PIC16F193X/LF193X
31.6
DS41364D-page 456
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C T
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Note 1: I
Param
No.
2: T
3: T
Thermal Considerations
P
DD
INTERNAL
A
J
T
Sym.
P
P
= Junction Temperature
JMAX
= Ambient Temperature
PD
DER
is current to run the chip alone without driving any load on the output pins.
JA
JC
I
/
O
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Case
Maximum Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
A
Characteristic
+125°C
Preliminary
Typ.
27.5
27.5
47.2
24.4
31.4
24.7
14.5
150
60
80
90
46
24
24
24
24
20
—
—
—
—
Units
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C
W
W
W
W
28-pin SPDIP package
28-pin SOIC package
28-pin SSOP package
28-pin UQFN 4x4mm package
28-pin QFN 6x6mm package
40-pin PDIP package
44-pin TQFP package
44-pin QFN 8x8mm package
28-pin SPDIP package
28-pin SOIC package
28-pin SSOP package
28-pin UQFN 4x4mm package
28-pin QFN 6x6mm package
40-pin PDIP package
44-pin TQFP package
44-pin QFN 8x8mm package
PD = P
P
P
P
INTERNAL
I
DER
/
O
= (I
= PD
INTERNAL
2009 Microchip Technology Inc.
OL
= I
MAX
* V
DD
Conditions
(T
OL
+ P
x V
J
) + (I
- T
DD
I
/
O
A
(1)
)/
OH
JA
(2)
* (V
DD
- V
OH
))
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