PIC18LF13K50-I/P Microchip Technology, PIC18LF13K50-I/P Datasheet - Page 213
![IC PIC MCU FLASH 4KX16 20-PDIP](/photos/12/13/121303/150-20-dip_sml.jpg)
PIC18LF13K50-I/P
Manufacturer Part Number
PIC18LF13K50-I/P
Description
IC PIC MCU FLASH 4KX16 20-PDIP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets
1.PIC18F13K50-ISS.pdf
(420 pages)
2.PIC18F13K50-ISS.pdf
(40 pages)
3.PIC18F13K50-ISS.pdf
(10 pages)
4.PIC18F13K50-ISS.pdf
(2 pages)
5.PIC18F13K50-ISO.pdf
(414 pages)
Specifications of PIC18LF13K50-I/P
Core Size
8-Bit
Program Memory Size
8KB (4K x 16)
Core Processor
PIC
Speed
48MHz
Connectivity
I²C, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
14
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
20-DIP (0.300", 7.62mm)
Controller Family/series
PIC18
No. Of I/o's
15
Eeprom Memory Size
256Byte
Ram Memory Size
512Byte
Cpu Speed
48MHz
No. Of Timers
4
Processor Series
PIC18LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
EUSART, I2C, MSSP, SPI, USB
Maximum Clock Frequency
32 KHz
Number Of Programmable I/os
18
Number Of Timers
4
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, DM164127, DV164126
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 12 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
- PIC18F13K50-ISS PDF datasheet
- PIC18F13K50-ISS PDF datasheet #2
- PIC18F13K50-ISS PDF datasheet #3
- PIC18F13K50-ISS PDF datasheet #4
- PIC18F13K50-ISO PDF datasheet #5
- Current page: 213 of 420
- Download datasheet (4Mb)
17.2.2
When the conversion is complete, the ADC module will:
• Clear the GO/DONE bit
• Set the ADIF flag bit
• Update the ADRESH:ADRESL registers with new
17.2.3
The discharge phase is used to initialize the value of
the capacitor array. The array is discharged after every
sample. This feature helps to optimize the unity-gain
amplifier, as the circuit always needs to charge the
capacitor array, rather than charge/discharge based on
previous measure values.
17.2.4
If a conversion must be terminated before completion,
the GO/DONE bit can be cleared by software. The
ADRESH:ADRESL registers will be updated with the
partially
sample. Unconverted bits will match the last bit
converted.
17.2.5
After the A/D conversion is completed or aborted, a
2 T
be started. After this wait, the currently selected
channel is reconnected to the charge holding capacitor
commencing the next acquisition.
17.2.6
The selection of the automatic acquisition time and A/D
conversion clock is determined in part by the clock
source and frequency while in a power-managed mode.
If the A/D is expected to operate while the device is in
a power-managed mode, the ACQT<2:0> and
ADCS<2:0> bits in ADCON2 should be updated in
accordance with the clock source to be used in that
mode. After entering the mode, an A/D acquisition or
conversion may be started. Once started, the device
should continue to be clocked by the same clock
source until the conversion has been completed.
If desired, the device may be placed into the
corresponding Idle mode during the conversion. If the
device clock frequency is less than 1 MHz, the A/D F
clock source should be selected.
2010 Microchip Technology Inc.
conversion result
Note:
AD
wait is required before the next acquisition can
complete
COMPLETION OF A CONVERSION
DISCHARGE
TERMINATING A CONVERSION
A device Reset forces all registers to their
Reset state. Thus, the ADC module is
turned off and any pending conversion is
terminated.
DELAY BETWEEN CONVERSIONS
ADC OPERATION IN POWER-
MANAGED MODES
Analog-to-Digital
conversion
Preliminary
RC
17.2.7
The ADC module can operate during Sleep. This
requires the ADC clock source to be set to the F
option. When the F
ADC waits one additional instruction before starting the
conversion. This allows the SLEEP instruction to be
executed, which can reduce system noise during the
conversion. If the ADC interrupt is enabled, the device
will wake-up from Sleep when the conversion
completes. If the ADC interrupt is disabled, the ADC
module is turned off after the conversion completes,
although the ADON bit remains set.
When the ADC clock source is something other than
F
sion to be aborted and the ADC module is turned off,
although the ADON bit remains set.
17.2.8
The CCP1 Special Event Trigger allows periodic ADC
measurements without software intervention. When
this trigger occurs, the GO/DONE bit is set by hardware
and the Timer1 or Timer3 counter resets to zero.
Using the Special Event Trigger does not assure proper
ADC timing. It is the user’s responsibility to ensure that
the ADC timing requirements are met.
See
information.
RC
, a SLEEP instruction causes the present conver-
Section 14.3.4 “Special Event Trigger”
PIC18F/LF1XK50
ADC OPERATION DURING SLEEP
SPECIAL EVENT TRIGGER
RC
clock source is selected, the
DS41350E-page 213
for more
RC
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