PIC16F914-I/PT Microchip Technology, PIC16F914-I/PT Datasheet - Page 253

IC PIC MCU FLASH 4KX14 44TQFP

PIC16F914-I/PT

Manufacturer Part Number
PIC16F914-I/PT
Description
IC PIC MCU FLASH 4KX14 44TQFP
Manufacturer
Microchip Technology
Series
PIC® 16Fr

Specifications of PIC16F914-I/PT

Program Memory Type
FLASH
Program Memory Size
7KB (4K x 14)
Package / Case
44-TQFP, 44-VQFP
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LCD, POR, PWM, WDT
Number Of I /o
35
Eeprom Size
256 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
SSP/I2C/AUSART/SPI
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
35
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DV164120, DM163029
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT44PT3 - SOCKET TRAN ICE 44MQFP/TQFPAC164305 - MODULE SKT FOR PM3 44TQFP444-1001 - DEMO BOARD FOR PICMICRO MCUAC164020 - MODULE SKT PROMATEII 44TQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F914-I/PT
Manufacturer:
Microchi
Quantity:
1 897
Part Number:
PIC16F914-I/PT
Manufacturer:
MICROCHIP
Quantity:
3 200
Part Number:
PIC16F914-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC16F914-I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
PIC16F914-I/PT
0
21.2
The following sections give the technical details of the
packages.
28-Lead Skinny Plastic Dual In-line (SP) – 300 mil Body (PDIP)
 2004 Microchip Technology Inc.
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-095
Drawing No. C04-070
Package Details
n
eB
E1
E
2
1
Dimension Limits
c
D
§
A1
A
Units
A2
eB
A1
E1
B1
D
p
A
E
L
B
n
c
MIN
1.345
.140
.125
.015
.300
.275
.125
.008
.040
.016
.320
Preliminary
5
5
B
B1
INCHES*
NOM
28
1.365
.100
.150
.130
.310
.285
.130
.012
.053
.019
.350
10
10
MAX
1.385
.160
.135
.325
.295
.135
.015
.065
.022
.430
15
15
MIN
34.16
3.56
3.18
0.38
6.99
3.18
0.20
8.13
7.62
1.02
0.41
5
5
MILLIMETERS
PIC16F91X
p
NOM
28
34.67
2.54
3.30
7.87
7.24
3.30
0.29
1.33
0.48
8.89
3.81
10
10
DS41250B-page 251
A2
L
MAX
35.18
10.92
4.06
3.43
8.26
7.49
3.43
0.38
1.65
0.56
15
15

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