PIC24HJ12GP201-I/P Microchip Technology, PIC24HJ12GP201-I/P Datasheet - Page 79
![IC PIC MCU FLASH 4KX24 18DIP](/photos/6/76/67657/18-dip_300mil__sml.jpg)
PIC24HJ12GP201-I/P
Manufacturer Part Number
PIC24HJ12GP201-I/P
Description
IC PIC MCU FLASH 4KX24 18DIP
Manufacturer
Microchip Technology
Series
PIC® 24Hr
Datasheets
1.PIC24HJ12GP201-ISO.pdf
(242 pages)
2.PIC24HJ12GP201-ISO.pdf
(8 pages)
3.PIC24HJ12GP201-ISO.pdf
(84 pages)
4.PIC24HJ12GP201-ISO.pdf
(12 pages)
5.PIC24HJ12GP201-IP.pdf
(234 pages)
Specifications of PIC24HJ12GP201-I/P
Program Memory Type
FLASH
Program Memory Size
12KB (4K x 24)
Package / Case
18-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
13
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC24HJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
1 KB
Interface Type
I2C/SPI/UART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
13
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120
Minimum Operating Temperature
- 40 C
On-chip Adc
6-ch x 10-bit or 6-ch x 12-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164337 - MODULE SOCKET FOR PM3 40DIP
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
APPENDIX E:
Revision C (June 2006)
• Added code protection Configuration register
• Added information about Unit ID
• Added ERASES, ERASEG and ERASEC
• Added checksum computation equation
Revision D (March 2007)
• Added information specific to the
• Added specific checksum computations for all
• Updated ICSP bulk/page erase and row/byte
• Added the P20 timing characteristic
• Updated timing characteristics and references to
• Updated the ICSP code examples
© 2010 Microchip Technology Inc.
descriptions
programming executive commands
dsPIC33FJ12GP201/202, dsPIC33FJ12MC201/
202 and PIC24HJ12GP201/202 devices in sev-
eral sections, including pinout diagrams, program
memory sizes and Device ID values
dsPIC33F and PIC24H devices
program code examples to show externally timed
operation (waiting for specific delay periods)
the timing characteristics
REVISION HISTORY
Revision E (June 2007)
• Removed list of devices from first page. This
• Added information specific to the following new
• Updated paragraph in
• Renamed Table 2-1 to “Pins Used During
• Reordered list of devices in Table 2-2, Table 3-2
• Removed all pin diagrams
• Updated checksum information in Table 3-2 for
• Added a Note to
• Changed bit 5 of the FOSCSEL register to
• Modified the first paragraph of
• Added
document covers all released dsPIC33F/PIC24H
devices, therefore, references to specific devices
are included when applicable
devices in several sections, including program
memory sizes, Configuration bit descriptions,
checksum computations, Configuration registers,
and Device ID values:
- dsPIC33FJ32GP202
- dsPIC33FJ32GP204
- dsPIC33FJ16GP304
- dsPIC33FJ32MC202
- dsPIC33FJ32MC204
- dsPIC33FJ16MC304
- PIC24HJ32GP202
- PIC24HJ32GP204
- PIC24HJ16GP304
During Programming”
location of complete pin diagrams
Programming”
and Table 7-1 by device family and memory size
the following devices:
- dsPIC33FJ12GP201
- dsPIC33FJ12GP202
- dsPIC33FJ12MC201
- dsPIC33FJ12MC201
- PIC24HJ12GP201
- PIC24HJ12GP202
unimplemented ( — ) in Table 3-4
“Programming Methodology”
Appendix A: “Hex File Format”
Section 3.6.1 “Overview”
Section 2.3 “Pins Used
to include reference to
Section 3.6.2
DS70152H-page 79