PIC16F88-I/SO Microchip Technology, PIC16F88-I/SO Datasheet - Page 456
![IC MCU FLASH 4KX14 EEPROM 18SOIC](/photos/6/76/67656/150-18-soic_sml.jpg)
PIC16F88-I/SO
Manufacturer Part Number
PIC16F88-I/SO
Description
IC MCU FLASH 4KX14 EEPROM 18SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F818-ISO.pdf
(6 pages)
4.PIC16F87-IP.pdf
(228 pages)
5.PIC16F87-IP.pdf
(8 pages)
6.PIC16F87-IP.pdf
(4 pages)
7.PIC16F87-IP.pdf
(8 pages)
8.PIC16F88-ISO.pdf
(214 pages)
Specifications of PIC16F88-I/SO
Program Memory Type
FLASH
Program Memory Size
7KB (4K x 14)
Package / Case
18-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
16
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 7x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
SSP/USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
16
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014
Minimum Operating Temperature
- 40 C
On-chip Adc
7-ch x 10-bit
Data Rom Size
256 B
A/d Bit Size
10 bit
A/d Channels Available
7
Height
2.31 mm
Length
11.53 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4 V
Width
7.49 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DVA12XP080 - ADAPTER DEVICE FOR MPLAB-ICEAC164010 - MODULE SKT PROMATEII DIP/SOIC
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F88-I/SO
Manufacturer:
ROHM
Quantity:
15 000
Part Number:
PIC16F88-I/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16F818-ISO PDF datasheet #3
- PIC16F87-IP PDF datasheet #4
- PIC16F87-IP PDF datasheet #5
- PIC16F87-IP PDF datasheet #6
- PIC16F87-IP PDF datasheet #7
- PIC16F88-ISO PDF datasheet #8
- Current page: 456 of 688
- Download datasheet (3Mb)
PICmicro MID-RANGE MCU FAMILY
24.6
DS31024A-page 24-14
Design Tips
Question 1:
Answer 1:
Polypropylene film capacitor is a good trade-off between cost, availability and performance
Question 2:
Answer 2:
A source is:
Southern Electronics Company
Telephone: (203) 876-7488
Question 3:
Answer 3:
That table is meant to be a good starting point, but does not include variation that is the result of
the device not operating at exactly 4 MHz; tolerance of the external capacitor and variations of
the Programmable Current Source, due to process and application temperature.
A conversion on the Bandgap Reference can be used to judge how to adjust the Programmable
Current Source Output to ensure proper A/D full scale conversions. Example code (routine
ad_optimize, in P14_RV10.ASM) for this adjustment is available with the PICDEM-14A Demo
Board, and may be also available on the Microchip web site.
Question 4:
Answer 4:
This may be caused by self heating of the DIE. Self heating of the DIE may be caused by a few
things, including:
• I/O sinking and/or sourcing significant amount of current
• Power dissipation of the device running
• Package type due to junction to ambient temperature coefficient of package
For best results the power dissipation should be kept low. Calibration is performed with the device
in a low power state.
Question 5:
Answer 5:
The high current components on your board may cause the ground potential difference across
the ground trace or ground plane. To minimize this effect, you should employ two system grounds
on the application board. The first ground, analog ground, used for the reference analog signals
(Slope A/D external capacitor ground, Resistor Divider ground, and etc.). No high current nor any
digital power returns should go through this analog ground system.
The second ground, digital ground, is used for all other digital logic in the system. The applica-
tion’s digital logic will inject noise onto this ground. Proper grounding techniques should be used
to minimize this noise.
These two grounds are connected at the PICmicro’s ground pin. Ideally the two grounds are
implemented using separate ground planes. In most cases, this can still be implemented on a
two layer board. One layer is used for both ground systems, where the two planes are separated
by a gap. The second layer is used as the trace layer.
(remember the PIC14C000 can operate in sleep mode)
What are some recommended Capacitor types?
Can you suggest some sources for Capacitors
I used the recommended capacitor and Programmable Current Source from
Table
I am using the PIC14C000 which also has the on-chip Temperature sensor.
The sensor results seem to be a little high.
My A/D conversion results seem affected by the operation of high current
components on my board. What can I do to minimize this?
24-2, and my A/D input range does not match.
1997 Microchip Technology Inc.
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