DSPIC30F2012-20I/SO Microchip Technology, DSPIC30F2012-20I/SO Datasheet - Page 59

• Manufacturer Part Number: DSPIC30F2012-20I/SO
• Description: IC DSPIC MCU/DSP 12K 28SOIC
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F2012-20I/SO

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 20 MIPS
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 20
• Program Memory Size: 12KB (4K x 24)
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SOIC (7.5mm Width)
• Core Frequency: 40MHz
• Embedded Interface Type: I2C, SPI, UART
• No. Of I/o's: 20
• Flash Memory Size: 12KB
• Supply Voltage Range: 2.5V To 5.5V
• Operating Temperature Range: -40°C To +85°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL
• Eeprom Size: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: DSPIC30F201220ISO

TABLE 13-1:
© 2010 Microchip Technology Inc.
AC/DC CHARACTERISTICS
P9b
P10
P11
P12a
P12b
P13a
P13b
Param.
No.
T
T
T
T
T
T
T
ERA
ERA
DLY
DLY
DLY
PROG
PROG
Sym
5
6
7
AC/DC CHARACTERISTICS (CONTINUED)
Delay between PGD ↓ by programming
executive to PGD released by
programming executive
Delay between PGD released by
programming executive to first PGC ↑ of
response
Delay between clocking out response
words
Row Programming cycle time
Row Programming cycle time
Bulk/Row Erase cycle time
Bulk/Row Erase cycle time
Characteristic
Standard Operating Conditions
(unless otherwise stated)
Operating Temperature: 25° C is recommended
Min
0.8
0.8
15
10
5
1
1
Max
2.6
2.6
—
—
—
4
4
Units
ms
ms
ms
ms
μs
μs
μs
DS70102K-page 59
ICSP mode
Enhanced
ICSP mode
ICSP mode
Enhanced
ICSP mode
Conditions
—
—
—