PIC16F870-I/SS Microchip Technology, PIC16F870-I/SS Datasheet - Page 158

• Manufacturer Part Number: PIC16F870-I/SS
• Description: IC MCU FLASH 2KX14 EE 28SSOP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F870-I/SS

• Core Size: 8-Bit
• Program Memory Size: 3.5KB (2K x 14)
• Core Processor: PIC
• Speed: 20MHz
• Connectivity: UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 22
• Program Memory Type: FLASH
• Eeprom Size: 64 x 8
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SSOP
• Controller Family/series: PIC16F
• No. Of I/o's: 22
• Eeprom Memory Size: 64Byte
• Ram Memory Size: 128Byte
• Cpu Speed: 20MHz
• No. Of Timers: 3
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Interface Type: USART
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 22
• Number Of Timers: 8
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022, DV164120
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 28 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: I3-DB16F871 - BOARD DAUGHTER ICEPIC3AC164307 - MODULE SKT FOR PM3 28SSOPAC164020 - MODULE SKT PROMATEII 44TQFPXLT28SS-1 - SOCKET TRANSITION ICE 28SSOP
• Lead Free Status / Rohs Status: Details

PIC16F870/871
44-Lead Plastic Leaded Chip Carrier (L) – Square (PLCC)
DS30569B-page 156
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Side 1 Chamfer Height
Corner Chamfer 1
Corner Chamfer (others)
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Footprint Width
Footprint Length
Lead Thickness
Upper Lead Width
Lower Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-047
Drawing No. C04-048
c
CH2 x 45
#leads=n1
Dimension Limits
n
E2
E1
1
E
2
CH1 x 45
Units
CH2
CH1
D2
A2
A3
E1
D1
E2
B1
n1
A1
A
E
D
B
n
p
c
D1
A2
MIN
.165
.145
.020
.024
.040
.000
.685
.685
.650
.650
.590
.590
.008
.026
.013
D
0
0
INCHES*
NOM
35
.050
.173
.153
.028
.029
.045
.005
.690
.690
.653
.653
.620
.620
.029
.020
.011
44
A
11
5
5
MAX
A3
.180
.160
.035
.034
.050
.010
.695
.695
.656
.656
.630
.630
.013
.032
.021
10
10
MIN
17.40
17.40
14.99
14.99
16.51
16.51
B1
4.19
3.68
1.02
0.00
0.20
0.66
0.33
D2
B
0.51
0.61
0
0
MILLIMETERS
p
 2003 Microchip Technology Inc.
NOM
17.53
17.53
16.59
16.59
15.75
15.75
1.27
4.39
3.87
0.74
1.14
0.13
0.27
0.74
0.71
0.51
44
11
5
5
A1
MAX
17.65
17.65
16.66
16.66
16.00
16.00
4.57
4.06
0.89
0.86
1.27
0.25
0.33
0.53
0.81
10
10