PIC18F2520-I/SO Microchip Technology, PIC18F2520-I/SO Datasheet - Page 397

• Manufacturer Part Number: PIC18F2520-I/SO
• Description: IC MCU FLASH 16KX16 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F2520-I/SO

• Program Memory Type: FLASH
• Program Memory Size: 32KB (16K x 16)
• Package / Case: 28-SOIC (7.5mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 25
• Eeprom Size: 256 x 8
• Ram Size: 1.5K x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 1.5 KB
• Interface Type: MSSP/SPI/I2C/PSP/USART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 25
• Number Of Timers: 4
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163022, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MILMCP3909RD-3PH1 - REF DESIGN MCP3909 3PH ENGY MTR
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

APPENDIX A:
Revision A (June 2004)
Original data sheet for PIC18F2420/2520/4420/4520
devices.
Revision B (January 2007)
This revision includes updates to the packaging
diagrams.
Revision C (June 2007)
This revision includes updates to Section 6.0 “Flash
Program Memory”, Section 23.0 “Special Features
of the CPU”, Section 26.0 “Electrical Characteris-
tics” and minor corrections applicable to Timer1,
EUSART and the packaging diagrams. Also added the
125°C specifications.
Revision D (July 2007)
This revision updated the extended temperature
information in Section 26.0 “Electrical Characteris-
tics”.
Revision E (October 2008)
This revision updated Section 26.0 “Electrical Charac-
teristics”, Section 27.0 “DC and AC Characteristics
Graphs and Tables” and Section 28.0 “Packaging
Information”.
TABLE B-1:
© 2008 Microchip Technology Inc.
Program Memory (Bytes)
Program Memory (Instructions)
Interrupt Sources
I/O Ports
Capture/Compare/PWM Modules
Enhanced
Capture/Compare/PWM Modules
Parallel Communications (PSP)
10-Bit Analog-to-Digital Module
Packages
Features
DEVICE DIFFERENCES
REVISION HISTORY
10 Input Channels
Ports A, B, C, (E)
28-Pin SPDIP
PIC18F2420
28-Pin SOIC
28-Pin QFN
16384
8192
PIC18F2420/2520/4420/4520
No
19
2
0
10 Input Channels
Ports A, B, C, (E)
28-Pin SPDIP
PIC18F2520
28-Pin SOIC
28-Pin QFN
APPENDIX B:
The differences between the devices listed in this data
sheet are shown in Table B-1.
32768
16384
No
19
2
0
Ports A, B, C, D, E
13 Input Channels
44-Pin TQFP
PIC18F4420
40-Pin PDIP
44-Pin QFN
16384
8192
Yes
20
DEVICE
DIFFERENCES
1
1
Ports A, B, C, D, E
13 Input Channels
DS39631E-page 395
44-Pin TQFP
PIC18F4520
40-Pin PDIP
44-Pin QFN
32768
16384
Yes
20
1
1