PIC16F76-I/SP Microchip Technology, PIC16F76-I/SP Datasheet - Page 329
![IC MCU FLASH 8KX14 A/D 28DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC16F76-I/SP
Manufacturer Part Number
PIC16F76-I/SP
Description
IC MCU FLASH 8KX14 A/D 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F818-ISO.pdf
(6 pages)
4.PIC16F73-ISP.pdf
(174 pages)
5.PIC16F73-ISP.pdf
(14 pages)
6.PIC16F73-ISP.pdf
(12 pages)
Specifications of PIC16F76-I/SP
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x8b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
I2C/SPI/USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
5-ch x 8-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F76-I/SP
Manufacturer:
MICROCHIP
Quantity:
10 000
Company:
Part Number:
PIC16F76-I/SP
Manufacturer:
MICROCHIP
Quantity:
53
Part Number:
PIC16F76-I/SP
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16F818-ISO PDF datasheet #3
- PIC16F73-ISP PDF datasheet #4
- PIC16F73-ISP PDF datasheet #5
- PIC16F73-ISP PDF datasheet #6
- Current page: 329 of 688
- Download datasheet (3Mb)
17.4.18.2 Bus Collision During a Repeated Start Condition
1997 Microchip Technology Inc.
SDA
SCL
RSEN
BCLIF
S
SSPIF
During a Repeated Start condition, a bus collision occurs if:
a)
b)
When the user de-asserts SDA and the pin is allowed to float high, the BRG is loaded with
SSPADD<6:0>, and counts down to zero. The SCL pin is then de-asserted, and when sampled
high, the SDA pin is sampled. If SDA is low, a bus collision has occurred (i.e. another master,
Figure
is reloaded and begins counting. If SDA goes from high to low before the BRG times out, no bus
collision occurs, because no two masters can assert SDA at exactly the same time.
If, however, SCL goes from high to low before the BRG times out and SDA has not already been
asserted, then a bus collision occurs. In this case, another master is attempting to transmit a data
’1’ during the Repeated Start condition,
If at the end of the BRG time out both SCL and SDA are still high, the SDA pin is driven low, the
BRG is reloaded, and begins counting. At the end of the count, regardless of the status of the
SCL pin, the SCL pin is driven low and the Repeated Start condition is complete.
Figure 17-38: Bus Collision During a Repeated Start Condition (Case 1)
A low level is sampled on SDA when SCL goes from low level to high level.
SCL goes low before SDA is asserted low, indicating that another master is attempting to
transmit a data ’1’.
17-38, is attempting to transmit a data ’0’). If, however, SDA is sampled high then the BRG
Preliminary
Sample SDA when SCL goes high.
If SDA = 0, set BCLIF and release SDA and SCL
Figure
17-39.
Section 17. MSSP
Cleared in software
'0'
'0'
DS31017A-page 17-53
17
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