PIC16F76-I/SP Microchip Technology, PIC16F76-I/SP Datasheet - Page 96
![IC MCU FLASH 8KX14 A/D 28DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC16F76-I/SP
Manufacturer Part Number
PIC16F76-I/SP
Description
IC MCU FLASH 8KX14 A/D 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F818-ISO.pdf
(6 pages)
4.PIC16F73-ISP.pdf
(174 pages)
5.PIC16F73-ISP.pdf
(14 pages)
6.PIC16F73-ISP.pdf
(12 pages)
Specifications of PIC16F76-I/SP
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x8b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
I2C/SPI/USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
5-ch x 8-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F76-I/SP
Manufacturer:
MICROCHIP
Quantity:
10 000
Company:
Part Number:
PIC16F76-I/SP
Manufacturer:
MICROCHIP
Quantity:
53
Part Number:
PIC16F76-I/SP
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16F818-ISO PDF datasheet #3
- PIC16F73-ISP PDF datasheet #4
- PIC16F73-ISP PDF datasheet #5
- PIC16F73-ISP PDF datasheet #6
- Current page: 96 of 688
- Download datasheet (3Mb)
PICmicro MID-RANGE MCU FAMILY
6.1
6.2
DS31006A-page 6-2
Introduction
Program Memory Organization
There are two memory blocks in the Section 6. Memory Organization; program memory and data
memory. Each block has its own bus, so that access to each block can occur during the same
oscillator cycle.
The data memory can further be broken down into General Purpose RAM and the Special Func-
tion Registers (SFRs). The operation of the SFRs that control the “core” are described here. The
SFRs used to control the peripheral modules are described in the section discussing each indi-
vidual peripheral module.
Mid-Range MCU devices have a 13-bit program counter capable of addressing an 8K x 14 pro-
gram memory space. The width of the program memory bus (instruction word) is 14-bits. Since
all instructions are a single word, a device with an 8K x 14 program memory has space for 8K of
instructions. This makes it much easier to determine if a device has sufficient program memory
for a desired application.
This program memory space is divided into four pages of 2K words each (0h - 7FFh, 800h -
FFFh, 1000h - 17FFh, and 1800h - 1FFFh).
as the 8 level deep hardware stack. Depending on the device, only a portion of this memory may
be implemented. Please refer to the device data sheet for the available memory.
To jump between the program memory pages, the high bits of the Program Counter (PC) must
be modified. This is done by writing the desired value into a SFR called PCLATH (Program
Counter Latch High). If sequential instructions are executed, the program counter will cross the
page boundaries without any user intervention. For devices that have less than 8K words,
accessing a location above the physically implemented address will cause a wraparound. That
is, in a 4K-word device accessing 17FFh actually addresses 7FFh. 2K-word devices (or less) do
not require paging.
Figure 6-1
shows the program memory map as well
1997 Microchip Technology Inc.
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