PIC16F76-I/SP Microchip Technology, PIC16F76-I/SP Datasheet - Page 33
![IC MCU FLASH 8KX14 A/D 28DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC16F76-I/SP
Manufacturer Part Number
PIC16F76-I/SP
Description
IC MCU FLASH 8KX14 A/D 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F818-ISO.pdf
(6 pages)
4.PIC16F73-ISP.pdf
(174 pages)
5.PIC16F73-ISP.pdf
(14 pages)
6.PIC16F73-ISP.pdf
(12 pages)
Specifications of PIC16F76-I/SP
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x8b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
I2C/SPI/USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
5-ch x 8-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F76-I/SP
Manufacturer:
MICROCHIP
Quantity:
10 000
Company:
Part Number:
PIC16F76-I/SP
Manufacturer:
MICROCHIP
Quantity:
53
Part Number:
PIC16F76-I/SP
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16F818-ISO PDF datasheet #3
- PIC16F73-ISP PDF datasheet #4
- PIC16F73-ISP PDF datasheet #5
- PIC16F73-ISP PDF datasheet #6
- Current page: 33 of 688
- Download datasheet (3Mb)
1997 Microchip Technology Inc.
Table 2-1:
Table 2-2:
Configuration bits
FOSC2:FOSC0
Configuration
FOSC1:FOSC0
1 1 1
1 1 0
1 0 1
1 0 0
0 1 1
0 1 0
0 0 1
0 0 0
bits
1 1
1 0
0 1
0 0
Selecting the Oscillator Mode for Devices with FOSC1:FOSC0
Selecting the Oscillator Mode for Devices with FOSC2:FOSC0
CLKOUT
CLKOUT
EXTRC
EXTRC
INTRC
INTRC
Mode
Mode
OSC
OSC
with
with
HS
XT
LP
RC
HS
—
XT
LP
Medium Gain Standard crystal/resonator frequency.
Medium Gain Standard crystal/resonator frequency.
Feedback
High Gain
Low Gain
Feedback
High Gain
Inverter
Low Gain
Inverter
OSC
Gain
OSC
Gain
—
—
—
—
—
—
Section 2. Oscillator
Least expensive solution for device oscillation
(only an external resistor and capacitor is
required). Most variation in time-base.
Device’s default mode.
High frequency application.
Oscillator circuit’s mode consumes the most
current of the three crystal modes.
Oscillator circuit’s mode consumes the middle
current of the three crystal modes.
Low power/frequency applications.
Oscillator circuit’s mode consumes the least
current of the three crystal modes.
Inexpensive solution for device oscillation. Most
variation in timebase. CLKOUT is enabled on
pin. Device’s default mode.
Inexpensive solution for device oscillation. Most
variation in timebase.
CLKOUT is disabled (use as I/O) on pin.
Least expensive solution for device oscillation.
4 MHz oscillator, which can be tuned.
CLKOUT is enabled on pin.
Least expensive solution for device oscillation.
4 MHz oscillator, which can be tuned.
CLKOUT is disabled (use as I/O) on pin.
Reserved
High frequency application.
Oscillator circuit’s mode consumes the most
current of the three crystal modes.
Oscillator circuit’s mode consumes the middle
current of the three crystal modes.
Low power/frequency applications.
Oscillator circuit’s mode consumes the least
current of the three crystal modes.
Comment
Comment
DS31002A-page 2-3
2
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