DSPIC30F4011-30I/ML Microchip Technology, DSPIC30F4011-30I/ML Datasheet - Page 227

• Manufacturer Part Number: DSPIC30F4011-30I/ML
• Description: IC DSPIC MCU/DSP 48K 44QFN
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F4011-30I/ML

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 30
• Program Memory Size: 48KB (16K x 24)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 9x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-QFN
• Core Frequency: 40MHz
• Core Supply Voltage: 5.5V
• Embedded Interface Type: CAN, I2C, SPI, UART
• No. Of I/o's: 30
• Flash Memory Size: 48KB
• Supply Voltage Range: 2.5V To 5.5V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT44QFN2 - SOCKET TRAN ICE 44QFN/40DIPAC164322 - MODULE SOCKET MPLAB PM3 28/44QFNDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: DSPIC30F401130IML

APPENDIX A:
Revision D (August 2006)
Previous versions of this data sheet contained
Advance or Preliminary Information. They were
distributed with incomplete characterization data.
This revision reflects these changes:
• Revised I
• Updated
• Base Instruction CP1 removed from instruction
• Revised Electrical Characteristics:
Revision E (January 2007)
© 2010 Microchip Technology Inc.
(see
Analog-to-Digital Converter (ADC) Module”
more fully describe configuration guidelines
set (see
- Operating Current (I
- Idle Current (I
- Power-Down Current (I
- I/O Pin Input Specifications
- BOR Voltage Limits
- Watchdog Timer Time-out Limits
- This revision includes updates to the
(seeTable
(see
(see
(see
(see
(see
packaging diagrams.
Table
Table
Table
Table
Table
Table
Table
2
Section 20.0 “10-bit, High-Speed
C Slave Addresses
17-1)
24-5)
24-6)
24-7)
24-8)
24-11)
24-21)
22-2)
IDLE
) Specifications
REVISION HISTORY
DD
) Specifications
PD
) Specifications
to
Revision F (March 2008)
This revision reflects these updates:
• Added Note 1 to 32-bit Timer4/5 Block Diagram
• Changed the location of the input reference in the
• Added FUSE Configuration Register (FICD)
• Removed erroneous statement regarding genera-
• Electrical Specifications:
• Corrected erroneous device number (see
• Additional minor corrections throughout the
(see
Diagram (see
10-bit High-Speed ADC Functional Block Diagram
(see
details (see
Registers”
tion of CAN receive errors (see
“Receive
- Resolved TBD values for parameters DO10,
- 10-bit High-Speed ADC t
- Parameter OS65 (Internal RC Accuracy) has
- Parameter DC12 (RAM Data Retention Volt-
- Parameter D134 (Erase/Write Cycle Time)
- Removed parameters OS62 (Internal FRC
- Parameter OS63 (Internal FRC Accuracy)
- Updated Min and Max values and Conditions
“Product Identification
document
dsPIC30F4011/4012
DO16, DO20, and DO26 (see
ter (time to stabilize) has been updated from
20 µs typical to 20 µs maximum (see
Table
been expanded to reflect multiple Min and
Max values for different temperatures (see
Table
age) has been updated to include a Min value
(see
has been updated to include Min and Max
values and the Typ value has been removed
(see
Jitter) and OS64 (Internal FRC Drift) and
Note 2 from AC Characteristics (see
Table
has been expanded to reflect multiple Min
and Max values for different temperatures
(see
for parameter SY11 and updated Min, Typ,
and Max values and Conditions for parame-
ter SY20 (see
Figure
Figure
Table
Table
Table
24-40)
24-18)
24-17)
Errors”)
Section 21.6 “Device Configuration
11-1) and 16-bit Timer4/5 Block
20-1)
and
24-4)
24-11)
24-17)
Figure
Table
Table
11-2)
21-8)
24-20)
System”)
PDU
timing parame-
Section 19.4.5
Table
DS70135G-page 227
24-9)