PIC18LF2610-I/SP Microchip Technology, PIC18LF2610-I/SP Datasheet - Page 276
![IC MCU FLASH 32KX16 28SDIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC18LF2610-I/SP
Manufacturer Part Number
PIC18LF2610-I/SP
Description
IC MCU FLASH 32KX16 28SDIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC18F2221-ISO.pdf
(46 pages)
2.PIC18LF2410-ISO.pdf
(376 pages)
3.PIC18LF2410-ISO.pdf
(8 pages)
4.PIC18F2515-ISO.pdf
(16 pages)
5.PIC18F2515-ISO.pdf
(6 pages)
6.PIC18F2515-ISO.pdf
(8 pages)
Specifications of PIC18LF2610-I/SP
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
25
Program Memory Size
64KB (32K x 16)
Program Memory Type
FLASH
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-DIP (0.300", 7.62mm)
Processor Series
PIC18LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3968 B
Interface Type
CCP, ECCP, EUSART, I2C, MSSP, SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
25
Number Of Timers
1 x 8
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
Data Rom Size
3968 B
Height
3.3 mm
Length
34.67 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2 V
Width
7.24 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
- PIC18F2221-ISO PDF datasheet
- PIC18LF2410-ISO PDF datasheet #2
- PIC18LF2410-ISO PDF datasheet #3
- PIC18F2515-ISO PDF datasheet #4
- PIC18F2515-ISO PDF datasheet #5
- PIC18F2515-ISO PDF datasheet #6
- Current page: 276 of 376
- Download datasheet (7Mb)
PIC18F2X1X/4X1X
DAW
Syntax:
Operands:
Operation:
Status Affected:
Encoding:
Description:
Words:
Cycles:
Example 1:
Example 2:
DS39636D-page 278
Q Cycle Activity:
Before Instruction
After Instruction
Before Instruction
After Instruction
Decode
W
C
DC
W
C
DC
W
C
DC
W
C
DC
Q1
=
=
=
=
=
=
=
=
=
=
=
=
register W
Decimal Adjust W Register
DAW
None
If [W<3:0> > 9] or [DC = 1] then
(W<3:0>) + 6 → W<3:0>;
else
(
If [W<7:4> + DC > 9] or [C = 1] then
(
else
(W<7:4>) + DC → W<7:4>
C
DAW adjusts the eight-bit value in W,
resulting from the earlier addition of two
variables (each in packed BCD format)
and produces a correct packed BCD
result.
1
1
DAW
W<3:0>) → W<3:0>;
W<7:4>) + 6 + DC → W<7:4> ;
Read
0000
Q2
A5h
0
0
05h
1
0
CEh
0
0
34h
1
0
0000
Process
Data
Q3
0000
Write
Q4
W
0111
DECF
Syntax:
Operands:
Operation:
Status Affected:
Encoding:
Description:
Words:
Cycles:
Example:
Q Cycle Activity:
Before Instruction
After Instruction
Decode
CNT
Z
CNT
Z
Q1
=
=
=
=
register ‘f’
Decrement f
DECF f {,d {,a}}
0 ≤ f ≤ 255
d ∈ [0,1]
a ∈ [0,1]
(f) – 1 → dest
C, DC, N, OV, Z
Decrement register ‘f’. If ‘d’ is ‘0’, the
result is stored in W. If ‘d’ is ‘1’, the
result is stored back in register ‘f’
(default).
If ‘a’ is ‘0’, the Access Bank is selected.
If ‘a’ is ‘1’, the BSR is used to select the
GPR bank (default).
If ‘a’ is ‘0’ and the extended instruction
set is enabled, this instruction operates
in Indexed Literal Offset Addressing
mode whenever f ≤ 95 (5Fh). See
Section 23.2.3 “Byte-Oriented and
Bit-Oriented Instructions in Indexed
Literal Offset Mode” for details.
1
1
DECF
Read
0000
Q2
01h
0
00h
1
© 2009 Microchip Technology Inc.
CNT,
01da
Process
Data
Q3
1, 0
ffff
destination
Write to
Q4
ffff
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