PIC32MX440F512H-80I/MR Microchip Technology, PIC32MX440F512H-80I/MR Datasheet - Page 9

• Manufacturer Part Number: PIC32MX440F512H-80I/MR
• Description: IC PIC MCU FLASH 512KX32 64-QFN
• Manufacturer: Microchip Technology
• Series: PIC® 32MXr

Specifications of PIC32MX440F512H-80I/MR

• Core Size: 32-Bit
• Program Memory Size: 512KB (512K x 8)
• Core Processor: MIPS32® M4K™
• Speed: 80MHz
• Connectivity: I²C, IrDA, LIN, PMP, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 53
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.3 V ~ 3.6 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-VFQFN, Exposed Pad
• Controller Family/series: PIC32
• Ram Memory Size: 32KB
• Cpu Speed: 80MHz
• No. Of Timers: 5
• Interface: EUSART, I2C, SPI, USB
• No. Of Pwm Channels: 5
• Embedded Interface Type: EUSART, I2C, SPI, USB
• Rohs Compliant: Yes
• Processor Series: PIC32MX4xx
• Core: MIPS
• Data Bus Width: 32 bit
• Data Ram Size: 32 KB
• Interface Type: I2C, JTAG, SPI, TWI, UART, USB
• Maximum Clock Frequency: 80 MHz
• Number Of Programmable I/os: 51
• Number Of Timers: 5
• Operating Supply Voltage: 2.3 V to 3.6 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, DM320003, DM320002, MA320002
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1000 - PIC32 BREAKOUT BOARD
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

5.2
In ICSP mode, the 2-wire ICSP signals are time
multiplexed into the 2-wire to 4-wire block. The 2-wire
to 4-wire block then converts the signals to look like a
4-wire JTAG port to the TAP controller.
There are two possible modes of operation:
• 4-Phase ICSP
• 2-Phase ICSP
5.2.1
In 4-Phase ICSP mode, the TDI, TDO and TMS device
pins are multiplexed onto PGD in 4 clocks (see
Figure 5-4). The Least Significant bit (LSb) is shifted
first; and TDI and TMS are sampled on the falling edge
FIGURE 5-4:
FIGURE 5-5:
© 2010 Microchip Technology Inc.
TMS
TMS
TCK
TDO
TCK
TDO
TDI
TDI
2-Wire ICSP Details
4-PHASE ICSP
‘1’
‘1’
PGC
PGD
2-WIRE, 4-PHASE
2-WIRE, 2-PHASE
‘1’
‘1’
pTDO = 1
‘0’
‘0’
PGD
PGC
‘0’
‘0’
TDI = IR0
TDI = IR0
IR0
IR0
1
1
TMS = 0
TMS = 0
of PGC, while TDO is driven on the falling edge of PGC.
4-Phase mode is used for both read and write data
transfers.
5.2.2
In 2-Phase ICSP mode, the TMS and TDI device pins
are multiplexed into PGD in 2 clocks (see Figure 5-5).
The LSb is shifted first; and TDI and TMS are sampled
on the falling edge of PGC. There is no TDO output pro-
vided in this mode. The 2-Phase ICSP mode was
designed to accelerate 2-wire, write-only transactions.
Note:
The packet is not actually executed until the
first clock of the next packet.
To enter 2-Wire, 2-Phase ICSP mode, the
TDOEN bit (DDPCON<0>) must be set to
‘0’.
nTDO = 0
2-PHASE ICSP
‘1’
‘1’
IR4
IR4
X
X
‘1’
‘1’
PIC32MX
‘0’
‘0’
DS61145G-page 9