STM32F101VBT6 STMicroelectronics, STM32F101VBT6 Datasheet - Page 68
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STM32F101VBT6
Manufacturer Part Number
STM32F101VBT6
Description
MCU ARM 128KB FLSH/TIMER 100LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Specifications of STM32F101VBT6
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
36MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
80
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LQFP
Processor Series
STM32F101x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
16 KB
Interface Type
I2C/SPI/USART
Maximum Clock Frequency
36 MHz
Number Of Programmable I/os
80
Number Of Timers
3
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
16-ch x 12-bit
For Use With
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Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-6061
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Quantity
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Electrical characteristics
68/87
Table 45.
1. ADC DC accuracy values are measured after internal calibration.
2. Better performance could be achieved in restricted V
3. ADC Accuracy vs. Negative Injection Current: Injecting negative current on any of the standard (non-
4. Based on characterization, not tested in production.
Figure 33. ADC accuracy characteristics
Symbol
4095
4094
4093
robust) analog input pins should be avoided as this significantly reduces the accuracy of the conversion
being performed on another analog input. It is recommended to add a Schottky diode (pin to ground) to
standard analog pins which may potentially inject negative current.
Any positive injection current within the limits specified for I
affect the ADC accuracy.
EO
EG
ED
ET
EL
7
6
5
4
3
2
1
0
V
SSA
[1LSB
1
E
Total unadjusted error
Offset error
Gain error
Differential linearity error
Integral linearity error
IDEAL
O
ADC accuracy
2
=
V
4096
3
REF+
Parameter
4
(or
V
5
1 LSB
4096
DDA
E
(1) (2) (3)
6
T
depending on package)]
IDEAL
Doc ID 13586 Rev 14
E
7
L
(2)
f
f
V
Measurements made after
ADC calibration
E
PCLK2
ADC
DDA
D
4093 4094 4095 4096
(3)
= 14 MHz, R
= 2.4 V to 3.6 V
= 28 MHz,
Test conditions
DD
(1)
, frequency, V
E
INJ(PIN)
G
V
AIN
DDA
and ΣI
< 10 kΩ,
(1) Example of an actual transfer curve
(2) The ideal transfer curve
(3) End point correlation line
E
between the actual and the ideal transfer curves.
E
transition and the first ideal one.
E
transition and the last actual one.
E
between actual steps and the ideal one.
E
between any actual transition and the end point
correlation line.
T
O
G
D
L
=Total Unadjusted Error: maximum deviation
=Integral Linearity Error: maximum deviation
REF
=Differential Linearity Error: maximum deviation
=Offset Error: deviation between the first actual
=Gain Error: deviation between the last ideal
STM32F101x8, STM32F101xB
INJ(PIN)
and temperature ranges.
in
±1.5
±1.5
±1.5
Typ
±2
±1
Section 5.3.12
Max
±2.5
±3
±2
±5
±3
(4)
does not
Unit
LSB
ai14395b