STM32F103VBT6 STMicroelectronics, STM32F103VBT6 Datasheet - Page 86

• Manufacturer Part Number: STM32F103VBT6
• Description: MCU ARM 128KB FLASH MEM 100-LQFP
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F103VBT6

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
• Peripherals: DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 80
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 20K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Processor Series: STM32F103x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 20 KB
• Interface Type: CAN/I2C/SPI/USART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 80
• Number Of Timers: 4
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: ST-LINK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (16-ch x 12-bit)
• Controller Family/series: (ARM Cortex) STM32
• No. Of I/o's: 80
• Ram Memory Size: 20KB
• Cpu Speed: 72MHz
• No. Of Timers: 4
• Cpu Family: STM32
• Device Core: ARM Cortex-M3
• Device Core Size: 32b
• Frequency (max): 72MHz
• Total Internal Ram Size: 20KB
• # I/os (max): 80
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 2V
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 100
• Package Type: LQFP
• For Use With: 497-10048 - BOARD EVAL ACCELEROMETER497-10030 - STARTER KIT FOR STM32497-9091 - LED BOARD FOR STM32 STP16DP05497-8853 - BOARD DEMO STM32 UNIV USB-UUSCIKSDKSTM32-PL - KIT IAR KICKSTART STM32 CORTEXM3497-8512 - KIT STARTER FOR STM32F10XE MCU497-8511 - KIT STARTER FOR STM32 512K FLASH497-8505 - KIT STARTER FOR STM32F10XE MCU497-8304 - KIT STM32 MOTOR DRIVER BLDC497-6438 - BOARD EVALUTION FOR STM32 512K497-6289 - KIT PERFORMANCE STICK FOR STM32MCBSTM32UME - BOARD EVAL MCBSTM32 + ULINK-MEMCBSTM32U - BOARD EVAL MCBSTM32 + ULINK2MCBSTM32 - BOARD EVAL FOR STM STM32X SER497-6053 - KIT STARTER FOR STM32497-6052 - KIT STARTER FOR STM32497-6050 - KIT STARTER FOR STM32497-6049 - KIT EVALUATION LOW COST STM32497-6048 - BOARD EVALUATION FOR STM32497-6047 - KIT DEVELOPMENT FOR STM32497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-6070

Package characteristics
6.2
6.2.1
86/96
Thermal characteristics
The maximum chip junction temperature (T
Table 9: General operating conditions on page
The maximum chip-junction temperature, T
using the following equation:
Where:
●
●
●
●
P
taking into account the actual V
application.
Table 57.
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
Symbol
I/O

JA
max represents the maximum power dissipation on output pins where:
T

P
P
internal power.
P
A
D
INT
I/O
JA
max is the maximum ambient temperature in C,
max is the sum of P
is the package junction-to-ambient thermal resistance, in C/W,
max = (V
Thermal resistance junction-ambient
LFBGA100 - 10 × 10 mm / 0.8 mm pitch
Thermal resistance junction-ambient
LQFP100 - 14 × 14 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP64 - 10 × 10 mm / 0.5 mm pitch
Thermal resistance junction-ambient
TFBGA64 - 5 × 5 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP48 - 7 x 7 mm / 0.5 mm pitch
Thermal resistance junction-ambient
VFQFPN 48 -7 × 7 mm / 0.5 mm pitch
Thermal resistance junction-ambient
VFQFPN 36 - 6 × 6 mm / 0.5 mm pitch
max is the product of I
Package thermal characteristics
OL
× I
OL
T
INT
) + ((V
J
Doc ID 13587 Rev 12
max = T
OL
max and P
DD
Parameter
/ I
and V
DD
OL
A
– V
and V
max + (P
DD
OH
I/O
J
J
, expressed in Watts. This is the maximum chip
max) must never exceed the values given in
max, in degrees Celsius, may be calculated
OH
) × I
max (P
36.
/ I
OH
D
OH
),
max × 
D
of the I/Os at low and high level in the
max = P
STM32F103x8, STM32F103xB
JA
)
INT
max + P
Value
44
46
45
65
55
16
18
I/O
max),
°C/W
Unit