MC9S12E256MPVE Freescale Semiconductor, MC9S12E256MPVE Datasheet - Page 73

IC MCU 256K FLASH 25MHZ 112-LQFP

MC9S12E256MPVE

Manufacturer Part Number
MC9S12E256MPVE
Description
IC MCU 256K FLASH 25MHZ 112-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheets

Specifications of MC9S12E256MPVE

Core Processor
HCS12
Core Size
16-Bit
Speed
25MHz
Connectivity
EBI/EMI, I²C, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
91
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 2.75 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
112-LQFP
Processor Series
S12E
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
16 KB
Interface Type
I2C/SCI/SPI
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
92
Number Of Timers
12
Operating Supply Voltage
0 V to 5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Minimum Operating Temperature
- 40 C
On-chip Adc
16-ch x 10-bit
On-chip Dac
2-ch x 8-bit
For Use With
M68EVB912E128 - BOARD EVAL FOR MC9S12E128/64
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC9S12E256MPVE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
1.7
The device will make available a security feature preventing the unauthorized read and write of the
memory contents. This feature allows:
The user must be reminded that part of the security must lie with the user’s code. An extreme example
would be user’s code that dumps the contents of the internal program. This code would defeat the purpose
of security. At the same time the user may also wish to put a back door in the user’s program. An example
of this is the user downloads a key through the SCI which allows access to a programming routine that
updates parameters.
1.7.1
Once the user has programmed the FLASH, the part can be secured by programming the security bits
located in the FLASH module. These non-volatile bits will keep the part secured through resetting the part
and through powering down the part.
The security byte resides in a portion of the Flash array.
Check
configuration.
1.7.2
1.7.2.1
This will be the most common usage of the secured part. Everything will appear the same as if the part was
not secured with the exception of BDM operation. The BDM operation will be blocked.
1.7.2.2
The user may wish to execute from external space with a secured microcontroller. This is accomplished
by resetting directly into expanded mode. The internal FLASH will be disabled. BDM operations will be
blocked.
1.7.3
In order to unsecure the microcontroller, the internal FLASH must be erased. This can be done through an
external program in expanded mode.
Once the user has erased the FLASH, the part can be reset into special single chip mode. This invokes a
program that verifies the erasure of the internal FLASH. Once this program completes, the user can erase
and program the FLASH security bits to the unsecured state. This is generally done through the BDM, but
the user could also change to expanded mode (by writing the mode bits through the BDM) and jumping to
Freescale Semiconductor
Chapter 2, “256 Kbyte Flash Module (FTS256K2V1)”
Protection of the contents of FLASH,
Operation in single-chip mode,
Operation from external memory with internal FLASH disabled.
Security
Securing the Microcontroller
Operation of the Secured Microcontroller
Unsecuring the Microcontroller
Normal Single Chip Mode
Executing from External Memory
MC9S12E256 Data Sheet, Rev. 1.08
Chapter 1 MC9S12E256 Device Overview (MC9S12E256DGV1)
for more details on the security
73

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