PIC12F675-E/SN Microchip Technology, PIC12F675-E/SN Datasheet - Page 120
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PIC12F675-E/SN
Manufacturer Part Number
PIC12F675-E/SN
Description
IC MCU CMOS 1K FLASH W/AD 8-SOIC
Manufacturer
Microchip Technology
Series
PIC® 12Fr
Datasheets
1.PIC12F629T-ISN.pdf
(136 pages)
2.PIC12F629T-ISN.pdf
(8 pages)
3.PIC12F629T-ISN.pdf
(24 pages)
4.PIC12F675-ESN.pdf
(132 pages)
Specifications of PIC12F675-E/SN
Program Memory Type
FLASH
Program Memory Size
1.75KB (1K x 14)
Package / Case
8-SOIC (3.9mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
POR, WDT
Number Of I /o
5
Eeprom Size
128 x 8
Ram Size
64 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC12F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
64 B
Interface Type
RS- 232/USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
6
Number Of Timers
2
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 53270-913
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
Minimum Operating Temperature
- 40 C
On-chip Adc
4-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
PIC12F629/675
8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S)
DS41190C-page 118
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC equivalent: pending
Drawing No. C04-113
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Base Thickness
Overall Length
Molded Package Length
Exposed Pad Length
Overall Width
Molded Package Width
Exposed Pad Width
Lead Width
Lead Length
Tie Bar Width
Mold Draft Angle Top
A1
n
1
α
TOP VIEW
2
E1
E
Dimension Limits
Units
A2
A1
A3
E1
E2
D1
D2
A
E
D
B
R
α
n
p
L
D1
A2
D
A3
MIN
.000
.152
.085
.014
.020
A
.008 REF.
INCHES
.050 BSC
.194 BSC
.184 BSC
.236 BSC
.226 BSC
NOM
EXPOSED
.0004
.033
.026
.158
.091
.016
.024
.014
METAL
PADS
8
MAX
R
.039
.031
.002
.163
.097
.019
.030
12
B
BOTTOM VIEW
MIN
E2
0.00
3.85
2.16
0.35
0.50
2003 Microchip Technology Inc.
MILLIMETERS*
p
0.20 REF.
1.27 BSC
4.92 BSC
4.67 BSC
5.99 BSC
5.74 BSC
NOM
0.85
0.65
0.01
0.40
0.60
.356
4.00
2.31
PIN 1
L
8
ID
D2
MAX
1.00
0.80
0.05
4.15
2.46
0.47
0.75
12