PIC18LF2523-I/SP Microchip Technology, PIC18LF2523-I/SP Datasheet - Page 372
![IC PIC MCU FLASH 16KX16 28-DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC18LF2523-I/SP
Manufacturer Part Number
PIC18LF2523-I/SP
Description
IC PIC MCU FLASH 16KX16 28-DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC18F2221-ISO.pdf
(46 pages)
2.PIC18F2423-ISP.pdf
(54 pages)
3.PIC18F2423-ISP.pdf
(8 pages)
4.PIC18F2423-ISP.pdf
(34 pages)
5.PIC18F2523-ISO.pdf
(392 pages)
Specifications of PIC18LF2523-I/SP
Core Size
8-Bit
Program Memory Size
32KB (16K x 16)
Core Processor
PIC
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
25
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-DIP (0.300", 7.62mm)
Controller Family/series
PIC18
No. Of I/o's
25
Eeprom Memory Size
256Byte
Ram Memory Size
1.5KB
Cpu Speed
40MHz
No. Of Timers
4
Package
28SPDIP
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Operating Supply Voltage
2.5|3.3|5 V
Data Bus Width
8 Bit
Number Of Programmable I/os
25
Interface Type
I2C/SPI/USART
On-chip Adc
10-chx12-bit
Number Of Timers
4
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
- PIC18F2221-ISO PDF datasheet
- PIC18F2423-ISP PDF datasheet #2
- PIC18F2423-ISP PDF datasheet #3
- PIC18F2423-ISP PDF datasheet #4
- PIC18F2523-ISO PDF datasheet #5
- Current page: 372 of 392
- Download datasheet (7Mb)
40-Lead Plastic Dual In-Line (P) – 600 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
PIC18F2423/2523/4423/4523
DS39755B-page 370
NOTE 1
A1
Note:
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
1 2 3
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
b
b1
D
Dimension Limits
Preliminary
Units
A2
A1
E1
eB
b1
N
D
e
A
E
L
b
c
e
A2
1.980
.125
.015
.590
.485
.008
.030
.014
MIN
.115
E1
–
–
L
.100 BSC
INCHES
NOM
40
Microchip Technology Drawing C04-016B
–
–
–
–
–
–
–
–
–
–
–
© 2007 Microchip Technology Inc.
eB
E
2.095
MAX
.250
.195
.625
.580
.200
.015
.070
.023
.700
–
c
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