C8051F353-GM Silicon Laboratories Inc, C8051F353-GM Datasheet - Page 23
![IC 8051 MCU 8K FLASH 28MLP](/photos/6/93/69391/sl-28-mlp_sml.jpg)
C8051F353-GM
Manufacturer Part Number
C8051F353-GM
Description
IC 8051 MCU 8K FLASH 28MLP
Manufacturer
Silicon Laboratories Inc
Series
C8051F35xr
Specifications of C8051F353-GM
Program Memory Type
FLASH
Program Memory Size
8KB (8K x 8)
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Core Processor
8051
Core Size
8-Bit
Speed
50MHz
Connectivity
SMBus (2-Wire/I²C), SPI, UART/USART
Peripherals
POR, PWM, Temp Sensor, WDT
Number Of I /o
17
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x16b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
C8051F3x
Core
8051
Data Bus Width
8 bit
Data Ram Size
768 B
Interface Type
I2C/SMBus/SPI/UART
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
17
Number Of Timers
4
Operating Supply Voltage
2.7 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
KSK-SL-TOOLSTICK, PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051F350DK
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 16-bit
On-chip Dac
2-ch x 8-bit
No. Of I/o's
17
Ram Memory Size
768Byte
Cpu Speed
50MHz
No. Of Timers
4
Rohs Compliant
Yes
Package
28QFN
Device Core
8051
Family Name
C8051F35x
Maximum Speed
50 MHz
Data Rom Size
128 B
Height
0.88 mm
Length
5 mm
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2.7 V
Width
5 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
770-1006 - ISP 4PORT FOR SILABS C8051F MCU336-1083 - DEV KIT FOR F350/351/352/353
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1273
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
C8051F353-GM
Manufacturer:
SiliconL
Quantity:
8 050
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1.3.
The CIP-51 has a standard 8051 program and data address configuration. It includes 256 bytes of data
RAM, with the upper 128 bytes dual-mapped. Indirect addressing accesses the upper 128 bytes of general
purpose RAM, and direct addressing accesses the 128 byte SFR address space. The lower 128 bytes of
RAM are accessible via direct and indirect addressing. The first 32 bytes are addressable as four banks of
general purpose registers, and the next 16 bytes can be byte addressable or bit addressable.
Program memory consists of 8 kB bytes of Flash. This memory may be reprogrammed in-system in 512
byte sectors, and requires no special off-chip programming voltage.
0x1DFF
0x1FFF
0x1E00
0x0000
On-Chip Memory
PROGRAM/DATA MEMORY
Programmable in 512
Byte Sectors)
RESERVED
(In-System
8 kB Flash
(Flash)
Figure 1.6. Memory Map
0xFFFF
0x01FF
0x0200
0x0000
0xFF
0x80
0x7F
0x30
0x2F
0x20
0x1F
0x00
Rev. 1.1
0x0000 to 0x01FF, wrapped
XRAM - 512 Bytes
(accessable using MOVX
Same 512 bytes as from
(Indirect Addressing
on 512-byte boundaries
(Direct and Indirect
INTERNAL DATA ADDRESS SPACE
EXTERNAL DATA ADDRESS SPACE
General Purpose
Upper 128 RAM
Bit Addressable
Addressing)
instruction)
Registers
Only)
DATA MEMORY (RAM)
C8051F350/1/2/3
(Direct Addressing Only)
Special Function
Lower 128 RAM
(Direct and Indirect
Addressing)
Register's
23
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