C8051F349-GM Silicon Laboratories Inc, C8051F349-GM Datasheet - Page 40

• Manufacturer Part Number: C8051F349-GM
• Description: IC 8051 MCU 32K FLASH MEM 32-QFN
• Manufacturer: Silicon Laboratories Inc
• Series: C8051F34xr

Specifications of C8051F349-GM

• Program Memory Type: FLASH
• Program Memory Size: 32KB (32K x 8)
• Package / Case: 32-QFN
• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 25MHz
• Connectivity: SMBus (2-Wire/I²C), SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 25
• Ram Size: 2.25K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: C8051F3x
• Core: 8051
• Data Bus Width: 8 bit
• Data Ram Size: 2304 B
• Interface Type: I2C, SPI, UART
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 25
• Number Of Timers: 4
• Operating Supply Voltage: 2.7 V to 5.25 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: KSK-SL-F34X, KSK-SL-TOOLSTICK, PK51, CA51, A51, ULINK2
• Development Tools By Supplier: C8051F340DK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 336-1748 - ADAPTER TOOLSTICK FOR C8051F34X
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1349-5

C8051F340/1/2/3/4/5/6/7/8/9/A/B/C/D
40
Notes:
General:
Solder Mask Design:
Stencil Design:
Card Assembly:
Dimension
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.
7. A 3x3 array of 1.0 mm openings on a 1.2mm pitch should be used for the center pad to assure
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small
C1
C2
X1
E
mask and the metal pad is to be 60m minimum, all the way around the pad.
to assure good solder paste release.
the proper paste volume.
Body Components.
Figure 4.9. QFN-32 Recommended PCB Land Pattern
Table 4.7. QFN-32 PCB Land Pattern Dimesions
4.80
4.80
0.20
Min
0.50 BSC
Max
4.90
4.90
0.30
Rev. 1.3
Dimension
X2
Y1
Y2
3.20
0.75
3.20
Min
Max
3.40
0.85
3.40