PIC10F220T-I/OT Microchip Technology, PIC10F220T-I/OT Datasheet - Page 78

• Manufacturer Part Number: PIC10F220T-I/OT
• Description: IC PIC MCU FLASH 256X12 SOT23-6
• Manufacturer: Microchip Technology
• Series: PIC® 10Fr

Specifications of PIC10F220T-I/OT

• Program Memory Type: FLASH
• Program Memory Size: 384B (256 x 12)
• Package / Case: SOT-23-6
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 8MHz
• Peripherals: POR, WDT
• Number Of I /o: 3
• Ram Size: 16 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC10F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 16 B
• Interface Type: USB
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 4
• Number Of Timers: 1
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2-ch x 8-bit
• Package: 6SOT-23
• Device Core: PIC
• Family Name: PIC10
• Maximum Speed: 8 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC162070 - HEADER INTRFC MPLAB ICD2 8/14PXLT06SOT - SOCKET TRAN ICE 6SOT W/CABLEAC163020 - ADAPTER PROGRAMMER PIC10F2XXAC164320 - MODULE SKT MPLAB PM3 80TQFPAC164037 - MODULE SKT 6L PROMATE II SOT23
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: PIC10F220T-I/OTTR

PIC10F220/222
DS41270E-page 76
8-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
NOTE 1
A
A1
b1
b
1
N
2
D
Dimension Limits
3
e
Units
L
A2
A1
E1
eB
E1
b1
N
D
A
E
e
L
c
b
A2
.115
.015
.290
.240
.348
.115
.008
.040
.014
MIN
–
–
eB
.100 BSC
E
INCHES
NOM
.365
.060
.018
.130
.310
.250
.130
.010
8
–
–
–
Microchip Technology Drawing C04-018B
© 2007 Microchip Technology Inc.
MAX
.210
.195
.325
.280
.400
.150
.015
.070
.022
.430
c
–