PIC10F220T-I/OT Microchip Technology, PIC10F220T-I/OT Datasheet - Page 79

• Manufacturer Part Number: PIC10F220T-I/OT
• Description: IC PIC MCU FLASH 256X12 SOT23-6
• Manufacturer: Microchip Technology
• Series: PIC® 10Fr

Specifications of PIC10F220T-I/OT

• Program Memory Type: FLASH
• Program Memory Size: 384B (256 x 12)
• Package / Case: SOT-23-6
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 8MHz
• Peripherals: POR, WDT
• Number Of I /o: 3
• Ram Size: 16 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC10F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 16 B
• Interface Type: USB
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 4
• Number Of Timers: 1
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2-ch x 8-bit
• Package: 6SOT-23
• Device Core: PIC
• Family Name: PIC10
• Maximum Speed: 8 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC162070 - HEADER INTRFC MPLAB ICD2 8/14PXLT06SOT - SOCKET TRAN ICE 6SOT W/CABLEAC163020 - ADAPTER PROGRAMMER PIC10F2XXAC164320 - MODULE SKT MPLAB PM3 80TQFPAC164037 - MODULE SKT 6L PROMATE II SOT23
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: PIC10F220T-I/OTTR

© 2007 Microchip Technology Inc.
8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A3
NOTE 1
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Overall Width
Exposed Pad Length
Exposed Pad Width
Contact Width
Contact Length
Contact-to-Exposed Pad
N
1
TOP VIEW
2
D
A1
Dimension Limits
A
E
NOTE 2
EXPOSED PAD
Units
D2
A1
A3
E2
N
A
D
E
K
e
b
L
L
K
0.80
0.00
MIN
1.30
1.50
0.18
0.30
0.20
MILLIMETERS
b
BOTTOM VIEW
0.50 BSC
0.20 REF
2.00 BSC
3.00 BSC
NOM
PIC10F220/222
0.90
0.02
0.25
0.40
8
–
–
–
Microchip Technology Drawing C04-123B
D2
2
e
1
N
MAX
1.00
0.05
0.50
1.75
1.90
0.30
–
E2
NOTE 1
DS41270E-page 77