PIC12LC671-04I/P Microchip Technology, PIC12LC671-04I/P Datasheet - Page 115
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PIC12LC671-04I/P
Manufacturer Part Number
PIC12LC671-04I/P
Description
IC MCU OTP 1KX14 LV A/D 8DIP
Manufacturer
Microchip Technology
Series
PIC® 12Cr
Specifications of PIC12LC671-04I/P
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
5
Program Memory Size
1.75KB (1K x 14)
Program Memory Type
OTP
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
8-DIP (0.300", 7.62mm)
Processor Series
PIC12LC
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Maximum Clock Frequency
4 MHz
Number Of Programmable I/os
5
Number Of Timers
8
Operating Supply Voltage
2.5 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000
Minimum Operating Temperature
- 40 C
On-chip Adc
8
For Use With
309-1051 - ADAPTER 8-DIP BD W/2 SO PLUGS
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
Details
14.0
14.1
1999 Microchip Technology Inc.
*
PACKAGING INFORMATION
Package Marking Information
Standard OTP marking consists of Microchip part number, year code, week code, facility code, mask
rev#, and assembly code. For OTP marking beyond this, certain price adders apply. Please check with
your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price.
8-Lead SOIC (208 mil)
8-Lead PDIP (300 mil)
8-Lead Windowed Ceramic Side Brazed (300 mil)
MMMMMM
Legend: MM...M
AABBCDE
Note:
MMMMMMM
XXXXXXX
MMMMMMMM
XXXXXCDE
MM
AABB
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
XX...X
AA
BB
C
D
E
Microchip part number information
Customer specific information*
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Facility code of the plant at which wafer is manufactured
O = Outside Vendor
C = 5” Line
S = 6” Line
H = 8” Line
Mask revision number
Assembly code of the plant or country of origin in which
part was assembled
Example
Example
Example
CE674
9924SAZ
12CE674
04/PSAZ
12C671
04I/SM
JW
9925
PIC12C67X
DS30561B-page 115