PIC16F688-I/P Microchip Technology, PIC16F688-I/P Datasheet - Page 162

• Manufacturer Part Number: PIC16F688-I/P
• Description: IC PIC MCU FLASH 4KX14 14DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F688-I/P

• Program Memory Type: FLASH
• Program Memory Size: 7KB (4K x 14)
• Package / Case: 14-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 12
• Eeprom Size: 256 x 8
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: SCI/USART
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 12
• Number Of Timers: 2
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• Data Rom Size: 256 B
• Height: 3.3 mm
• Length: 19.05 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2 V
• Width: 6.35 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC162066 - HEADER INTRFC MPLAB ICD2 20PINAC162061 - HEADER INTRFC MPLAB ICD2 20PINDM163029 - BOARD PICDEM FOR MECHATRONICSAC162056 - HEADER INTERFACE ICD2 16F688ACICE0207 - MPLABICE 14P 300 MIL ADAPTERAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC16F688
16.2
The following sections give the technical details of the
packages.
14-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
DS41203B-page 160
Package Details
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-005
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
n
E1
eB
E
Dimension Limits
2
1
§
c
D
Units
A2
E1
B1
eB
A1
A
E
D
B
n
p
L
c
A
A1
MIN
Preliminary
.140
.115
.015
.300
.240
.740
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
.100
.155
.130
.313
.250
.750
.130
.012
.058
.018
.370
14
10
10
B
B1
MAX
.170
.145
.325
.260
.760
.135
.015
.070
.022
.430
15
15
MIN
18.80
3.56
2.92
0.38
7.62
6.10
3.18
0.20
1.14
0.36
7.87
p
5
5
MILLIMETERS
 2004 Microchip Technology Inc.
NOM
19.05
2.54
3.94
3.30
7.94
6.35
3.30
0.29
1.46
0.46
9.40
A2
14
10
10
L
MAX
19.30
10.92
4.32
3.68
8.26
6.60
3.43
0.38
1.78
0.56
15
15