PIC16F886-E/ML Microchip Technology, PIC16F886-E/ML Datasheet - Page 260
PIC16F886-E/ML
Manufacturer Part Number
PIC16F886-E/ML
Description
IC PIC MCU FLASH 8KX14 28QFN
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.MCP1631RD-MCC2.pdf
(328 pages)
3.PIC16F882-ISS.pdf
(16 pages)
4.PIC16F882-ISS.pdf
(36 pages)
5.PIC16F883-ISO.pdf
(288 pages)
Specifications of PIC16F886-E/ML
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
24
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
MSSP/EUSART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
24
Number Of Timers
3
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM164123, DM164120-3, DV164122
Minimum Operating Temperature
- 40 C
On-chip Adc
11-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM164123 - KIT MANAGEMENT SYSTEM PICDEM
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
- PIC16F616T-ISL PDF datasheet
- MCP1631RD-MCC2 PDF datasheet #2
- PIC16F882-ISS PDF datasheet #3
- PIC16F882-ISS PDF datasheet #4
- PIC16F883-ISO PDF datasheet #5
- Current page: 260 of 288
- Download datasheet (5Mb)
PIC16F882/883/884/886/887
TABLE 17-10: PIC16F882/883/884/886/887 A/D CONVERSION REQUIREMENTS
DS41291D-page 258
Standard Operating Conditions (unless otherwise stated)
Operating temperature
AD130* T
AD131 T
AD132* T
AD133* T
AD134 T
Note 1:
Param
No.
2:
*
† Data in “Typ” column is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance
Sym
AD
CNV
ACQ
AMP
GO
These parameters are characterized but not tested.
only and are not tested.
ADRESH and ADRESL registers may be read on the following T
See Section 9.3 “A/D Acquisition Requirements” for minimum conditions.
A/D Clock Period
A/D Internal RC
Oscillator Period
Conversion Time
(not including
Acquisition Time)
Acquisition Time
Amplifier Settling Time
Q4 to A/D Clock Start
Characteristic
-40°C ≤ T
(1)
A
≤ +125°C
Min
1.6
3.0
3.0
1.6
—
—
—
—
T
OSC
Preliminary
T
Typ†
OSC
11.5
6.0
4.0
/2 + T
—
—
11
—
/2
CY
Max Units
9.0
9.0
9.0
6.0
—
—
—
—
5
T
μs
μs
μs
μs
μs
μs
—
—
AD
CY
T
T
ADCS<1:0> = 11 (ADRC mode)
At V
At V
Set GO/DONE bit to new data in A/D
Result register
If the A/D clock source is selected as
RC, a time of T
A/D clock starts. This allows the SLEEP
instruction to be executed.
OSC
OSC
cycle.
DD
DD
-based, V
-based, V
= 2.5V
= 5.0V
© 2007 Microchip Technology Inc.
Conditions
REF
REF
CY
≥ 3.0V
is added before the
full range
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