PIC16F886-E/ML Microchip Technology, PIC16F886-E/ML Datasheet - Page 269
PIC16F886-E/ML
Manufacturer Part Number
PIC16F886-E/ML
Description
IC PIC MCU FLASH 8KX14 28QFN
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.MCP1631RD-MCC2.pdf
(328 pages)
3.PIC16F882-ISS.pdf
(16 pages)
4.PIC16F882-ISS.pdf
(36 pages)
5.PIC16F883-ISO.pdf
(288 pages)
Specifications of PIC16F886-E/ML
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
24
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
MSSP/EUSART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
24
Number Of Timers
3
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM164123, DM164120-3, DV164122
Minimum Operating Temperature
- 40 C
On-chip Adc
11-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM164123 - KIT MANAGEMENT SYSTEM PICDEM
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
- PIC16F616T-ISL PDF datasheet
- MCP1631RD-MCC2 PDF datasheet #2
- PIC16F882-ISS PDF datasheet #3
- PIC16F882-ISS PDF datasheet #4
- PIC16F883-ISO PDF datasheet #5
- Current page: 269 of 288
- Download datasheet (5Mb)
© 2007 Microchip Technology Inc.
28-Lead Plastic Shrink Small Outline (SS) – 5.30 mm Body [SSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.20 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A
A1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Lead Thickness
Foot Angle
Lead Width
N
1 2
b
D
Dimension Limits
PIC16F882/883/884/886/887
e
Preliminary
E1
Units
A2
A1
E1
L1
N
A
E
D
e
L
c
φ
b
A2
E
MIN
1.65
0.05
7.40
5.00
9.90
0.55
0.09
0.22
c
0°
–
MILLIMETERS
L1
0.65 BSC
1.25 REF
10.20
NOM
1.75
7.80
5.30
0.75
28
4°
–
–
–
–
Microchip Technology Drawing C04-073B
10.50
MAX
2.00
8.20
0.38
1.85
5.60
0.95
0.25
8°
–
DS41291D-page 267
φ
L
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