PIC16F886-I/SP Microchip Technology, PIC16F886-I/SP Datasheet - Page 32
![IC PIC MCU FLASH 8KX14 28DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC16F886-I/SP
Manufacturer Part Number
PIC16F886-I/SP
Description
IC PIC MCU FLASH 8KX14 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.MCP1631RD-MCC2.pdf
(328 pages)
3.PIC16F882-ISS.pdf
(16 pages)
4.PIC16F882-ISS.pdf
(36 pages)
5.PIC16F883-ISO.pdf
(288 pages)
Specifications of PIC16F886-I/SP
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
24
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
MSSP/EUSART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
24
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM164123, DM164120-3, DV164122
Minimum Operating Temperature
- 40 C
On-chip Adc
11-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM164123 - KIT MANAGEMENT SYSTEM PICDEMDVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F886-I/SP
Manufacturer:
NXP
Quantity:
2 400
PIC16F88X
TABLE 5-1:
5.3.2
The programmer should be able to read data memory
information from a hex file and conversely (as an
option), write data memory contents to a hex file along
with program memory information and Configuration
Words (0x2007-0x2008) and user ID (0x2000-0x2003)
information.
The physical address range of the 256 data memory is
0x0000-0x00FF. However, these
logically mapped to address 0x2100-0x21FF for use in
writing assembly code. This provides a way of
differentiating between the data and program memory
locations in this range. The format for data memory
storage is one data byte per address location, LSb
aligned. A simple example of data memory is given
below:
DS41287D-page 32
PIC16F882
PIC16F883
PIC16F884
PIC16F886
PIC16F887
Legend: CFG = Configuration Word. Example calculations assume Configuration Word is erased (all ‘1’s).
Device
org 0x2100
de “My Program, v1.0”, 0
SUM[a:b] = [Sum of locations a to b inclusive]
SUM_ID = User ID locations masked by 0xF then made into a 16-bit value with ID0 as the Most Significant
nibble.
*Checksum = [Sum of all the individual expressions] MODULO [0xFFFF]
+ = Addition
& = Bitwise AND
EMBEDDING DATA MEMORY
CONTENTS IN HEX FILE
For example, ID0 = 0x1, ID1 = 0x2, ID3 = 0x3, ID4 = 0x4, then SUM_ID = 0x1234.
The 4 LSbs of the unprotected checksum is used for the example calculations.
Protect
CP = 1
CP = 0
CP = 1
CP = 0
CP = 1
CP = 0
CP = 1
CP = 0
CP = 1
CP = 0
Code
CHECKSUM COMPUTATIONS
SUM[0x0000:0x07FF] + (CFG1 & 0x3FFF) + (CFG2 & 0x0700)
(CFG1 & 0x3FFF) + (CFG2 & 0x0700) + SUM_ID
SUM[0x0000:0x0FFF] + (CFG1 & 0x3FFF) + (CFG2 & 0x0700)
(CFG1 & 0x3FFF) + (CFG2 & 0x0700) + SUM_ID
SUM[0x0000:0x0FFF] + (CFG1 & 0x3FFF) + (CFG2 & 0x0700)
(CFG1 & 0x3FFF) + (CFG2 & 0x0700) + SUM_ID
SUM[0x0000:0x1FFF] + (CFG1 & 0x3FFF) + (CFG2 & 0x0700)
(CFG1 & 0x3FFF) + (CFG2 & 0x0700) + SUM_ID
SUM[0x0000:0x1FFF] + (CFG1 & 0x3FFF) + (CFG2 & 0x0700)
(CFG1 & 0x3FFF) + (CFG2 & 0x0700) + SUM_ID
addresses are
Checksum*
2009 Microchip Technology Inc.
0x7DBE
0x7DBE
0x6DBE
0x6DBE
0x3EFF
0x85BE
0x36FF
0x36FF
0x26FF
0x26FF
Blank
Value
0x25E6 at 0
and Max
Address
0x0ACD
0xF2CD
0xF2CD
0x02CD
0x02CD
0x518C
0x498C
0x498C
0x398C
0x398C