PIC16LC554-04I/P Microchip Technology, PIC16LC554-04I/P Datasheet - Page 75
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PIC16LC554-04I/P
Manufacturer Part Number
PIC16LC554-04I/P
Description
IC MCU OTP 512X14 18DIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheet
1.PIC16C554-04P.pdf
(108 pages)
Specifications of PIC16LC554-04I/P
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
13
Program Memory Size
896B (512 x 14)
Program Memory Type
OTP
Ram Size
80 x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
18-DIP (0.300", 7.62mm)
Processor Series
PIC16LC
Core
PIC
Data Bus Width
8 bit
Data Ram Size
80 B
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
13
Number Of Timers
8
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Details
10.0
Absolute Maximum Ratings †
Ambient Temperature under bias ...............................................................................................................-40° to +125°C
Storage Temperature ................................................................................................................................ -65° to +150°C
Voltage on any pin with respect to V
Voltage on V
Voltage on MCLR with respect to V
Total power Dissipation (Note 1)...............................................................................................................................1.0W
Maximum Current out of V
Maximum Current into V
Input Clamp Current, I
Output Clamp Current, I
Maximum Output Current sunk by any I/O pin ........................................................................................................25 mA
Maximum Output Current sourced by any I/O pin...................................................................................................25 mA
Maximum Current sunk by PORTA, PORTB and PORTC ....................................................................................200 mA
Maximum Current sourced by PORTA, PORTB and PORTC ...............................................................................200 mA
2002 Microchip Technology Inc.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note 1: Power dissipation is calculated as follows: P
ELECTRICAL SPECIFICATIONS
DD
with respect to V
IK
OK
DD
(V
SS
I
(V0 < 0 or V0 > V
pin .............................................................................................................................250 mA
< 0 or V
pin ..........................................................................................................................300 mA
SS
SS
................................................................................................................. 0 to +7.5V
SS
I
> V
................................................................................................................0 to +14V
(except V
DD
) ........................................................................................................ ±20 mA
DD
).................................................................................................. ±20 mA
DD
Preliminary
and MCLR) .......................................................-0.6V to V
DIS
= V
DD
x {I
DD
- ∑ I
OH
} + ∑ {(V
DD
PIC16C55X
-V
OH
) x I
OH
DS40143D-page 73
} + ∑(V
DD
O
l x I
+0.6V
OL
)