PIC18LF25K22-I/SP Microchip Technology, PIC18LF25K22-I/SP Datasheet - Page 440

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PIC18LF25K22-I/SP

Manufacturer Part Number
PIC18LF25K22-I/SP
Description
MCU 8BIT 32KB FLASH 3.6V 28SDIP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr

Specifications of PIC18LF25K22-I/SP

Program Memory Type
FLASH
Program Memory Size
32KB (16K x 16)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
64MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
24
Eeprom Size
256 x 8
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 19x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1536 B
Interface Type
I2C, SPI, EUSART
Maximum Clock Frequency
64 MHz
Number Of Programmable I/os
25
Number Of Timers
7
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 17 Channel
On-chip Dac
5 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
PIC18(L)F2X/4XK22
FIGURE 27-3:
TABLE 27-4:
DS41412D-page 440
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C  T
Param
No.
† Production tested at T
Symbol
(HLVDIF set by hardware)
HIGH/LOW-VOLTAGE DETECT CHARACTERISTICS
HLVD Voltage on V
Transition High-to-
Low
HLVDIF
HIGH/LOW-VOLTAGE DETECT CHARACTERISTICS
Characteristic
V
DD
AMB
A
 +125°C
V
= 25°C. Specifications over temperature limits ensured by characterization.
DD
HLVD
HLVDL<3:0>
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
1101
1110
1111
Preliminary
Min
V(HLVDIN pin)
Typ†
1.80
2.05
2.25
2.40
2.50
2.75
2.80
2.95
3.25
3.45
3.65
3.80
4.10
4.35
4.70
Max
Units
(HLVDIF can be
cleared by software)
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
v
 2010 Microchip Technology Inc.
Conditions

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