PIC18F65J10-I/PT Microchip Technology, PIC18F65J10-I/PT Datasheet - Page 15

IC PIC MCU FLASH 16KX16 64TQFP

PIC18F65J10-I/PT

Manufacturer Part Number
PIC18F65J10-I/PT
Description
IC PIC MCU FLASH 16KX16 64TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F65J10-I/PT

Program Memory Type
FLASH
Program Memory Size
32KB (16K x 16)
Package / Case
64-TFQFP
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
50
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
SPI/I2C/EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
50
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DV164136, DM183022, DM183032
Minimum Operating Temperature
- 40 C
On-chip Adc
11-ch x 10-bit
Package
64TQFP
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Operating Supply Voltage
2.5|3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
MA180015 - MODULE PLUG-IN 18F87J10 FOR HPCAC162062 - HEADER INTRFC MPLAB ICD2 64/80PAC164327 - MODULE SKT FOR 64TQFP
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F65J10-I/PT
Manufacturer:
FSC
Quantity:
1 000
Part Number:
PIC18F65J10-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
3.1.2
It is possible to erase a single row (1024 bytes of data),
provided the block is not code-protected. Rows are
located at static boundaries, beginning at program
memory address, 000000h, extending to the internal
program memory limit (see Section 2.2 “Memory
Maps”).
The Row Erase duration is internally timed. After the
WR bit in EECON1 is set, a NOP is issued, where the
4th PGC is held high for the duration of the Row Erase
time, P10.
The
PIC18F6XJXX/8XJXX device is shown in Table 3-2. The
flowchart, shown in Figure 3-3, depicts the logic neces-
sary to completely erase a PIC18F6XJXX/8XJXX
device. The timing diagram that details the “Row Erase”
operation and parameter, P10, is shown in Figure 3-3.
TABLE 3-2:
 2009 Microchip Technology Inc.
Step 1: Enable memory writes.
Step 2: Point to first row in code memory.
Step 3: Enable erase and erase single row.
Step 4: Repeat step 3, with Address Pointer incremented by 1024 until all rows are erased.
Note:
Command
0000
0000
0000
0000
0000
0000
0000
4-Bit
code
ICSP ROW ERASE
The TBLPTR register can point at any byte
within the row intended for erase.
sequence
84 A6
6A F8
6A F7
6A F6
88 A6
82 A6
00 00
ERASE CODE MEMORY CODE SEQUENCE
Data Payload
to
Row
BSF
CLRF
CLRF
CLRF
BSF
BSF
NOP – hold PGC high for time P10.
Erase
EECON1, WREN
TBLPTRU
TBLPTRH
TBLPTRL
EECON1, FREE
EECON1, WR
a
PIC18F6XJXX/8XJXX
FIGURE 3-3:
Addr = Addr + 1024
Core Instruction
ROW ERASE CODE
MEMORY FLOW
No
Start Erase Sequence
and Hold PGC High
for Time P10
Row Erase
DS39644L-page 15
Device for
Configure
Done?
Rows
Done
Start
All
Yes
Addr = 0

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