PIC18F47J53T-I/ML Microchip Technology, PIC18F47J53T-I/ML Datasheet - Page 342

IC MCU 8BIT 128KB FLASH 44 QFN

PIC18F47J53T-I/ML

Manufacturer Part Number
PIC18F47J53T-I/ML
Description
IC MCU 8BIT 128KB FLASH 44 QFN
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets

Specifications of PIC18F47J53T-I/ML

Program Memory Type
FLASH
Program Memory Size
128KB (64K x 16)
Package / Case
*
Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, LIN, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
34
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
2.15 V ~ 3.6 V
Data Converters
A/D 13x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3.8 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
48 MHz
Number Of Programmable I/os
22
Number Of Timers
8
Operating Supply Voltage
2.15 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
MA180029 - BOARD DEMO PIC18F47J53 FS USB
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F47J53T-I/ML
Manufacturer:
MURATA
Quantity:
640 000
PIC18F47J53 FAMILY
20.5.17.2
During a Repeated Start condition, a bus collision
occurs if:
a)
b)
When the user deasserts SDAx and the pin is allowed
to float high, the BRG is loaded with SSPxADD<6:0>
and counts down to 0. The SCLx pin is then deasserted
and when sampled high, the SDAx pin is sampled.
FIGURE 20-31:
FIGURE 20-32:
DS39964B-page 342
A low level is sampled on SDAx when SCLx
goes from a low level to a high level.
SCLx goes low before SDAx is asserted low,
indicating that another master is attempting to
transmit a data ‘1’.
SDAx
SCLx
BCLxIF
RSEN
S
SSPxIF
SDAx
SCLx
RSEN
BCLxIF
S
SSPxIF
Bus Collision During a Repeated
Start Condition
BUS COLLISION DURING A REPEATED START CONDITION (CASE 1)
BUS COLLISION DURING REPEATED START CONDITION (CASE 2)
SCLx goes low before SDAx,
set BCLxIF. Release SDAx and SCLx.
Preliminary
T
BRG
Sample SDAx when SCLx goes high.
If SDAx = 0, set BCLxIF and release SDAx and SCLx.
If SDAx is low, a bus collision has occurred (i.e., another
master is attempting to transmit a data ‘0’; see
Figure 20-31). If SDAx is sampled high, the BRG is
reloaded and begins counting. If SDAx goes from
high-to-low before the BRG times out, no bus collision
occurs because no two masters can assert SDAx at
exactly the same time.
If SCLx goes from high-to-low before the BRG times
out and SDAx has not already been asserted, a bus
collision occurs. In this case, another master is
attempting to transmit a data ‘1’ during the Repeated
Start condition (see Figure 20-32).
If, at the end of the BRG time-out, both SCLx and SDAx
are still high, the SDAx pin is driven low and the BRG is
reloaded and begins counting. At the end of the count,
regardless of the status of the SCLx pin, the SCLx pin is
driven low and the Repeated Start condition is complete.
Cleared in software
T
BRG
 2010 Microchip Technology Inc.
Interrupt cleared
in software
‘0’
‘0’
‘0’

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