PIC24FJ32GA102-I/SO Microchip Technology, PIC24FJ32GA102-I/SO Datasheet - Page 300
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PIC24FJ32GA102-I/SO
Manufacturer Part Number
PIC24FJ32GA102-I/SO
Description
IC MCU 16BIT 32KB FLASH 28SOIC
Manufacturer
Microchip Technology
Series
PIC® XLP™ 24Fr
Datasheets
1.PIC24FJ32GA102-ISP.pdf
(308 pages)
2.PIC24FJ32GA102-ISP.pdf
(12 pages)
3.PIC24FJ32GA102-ISP.pdf
(48 pages)
4.PIC24FJ64GA104-IML.pdf
(300 pages)
Specifications of PIC24FJ32GA102-I/SO
Program Memory Type
FLASH
Program Memory Size
32KB (11K x 24)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
16-Bit
Speed
32MHz
Connectivity
I²C, IrDA, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
21
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC24FJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
8 KB
Interface Type
I2C/IrDA/SPI/UART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
21
Number Of Timers
5
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, DM240001, MA240020, DM240002, DM240011, DV164033
Minimum Operating Temperature
- 40 C
On-chip Adc
10-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
PIC24FJ64GA104 FAMILY
CRC
CTMU
Customer Change Notification Service ............................. 303
Customer Notification Service........................................... 303
Customer Support ............................................................. 303
D
Data Memory
DC Characteristics
Deep Sleep Watchdog Timer (DSWDT) ........................... 248
Development Support ....................................................... 251
DISVREG Pin.................................................................... 246
E
Electrical Characteristics
Equations
Errata .................................................................................... 8
Examples
DS39951C-page 300
Registers ................................................................... 215
Typical Operation ...................................................... 215
User Interface ........................................................... 214
Measuring Capacitance ............................................ 235
Measuring Time ........................................................ 236
Pulse Generation and Delay ..................................... 236
Address Space............................................................ 33
Memory Map ............................................................... 33
Near Data Space ........................................................ 34
SFR Space.................................................................. 34
Software Stack ............................................................ 47
Space Organization and Alignment ............................ 34
Comparator Specifications ........................................ 276
Comparator Voltage Reference Specifications ......... 276
I/O Pin Input Specifications ....................................... 274
I/O Pin Output Specifications .................................... 275
Idle Current ............................................................... 269
Internal Voltage Regulator Specifications ................. 276
Operating Current ..................................................... 267
Power-Down Base Current ....................................... 271
Power-Down Peripheral Module Current (I
Program Memory ...................................................... 275
Temperature and Voltage Specifications .................. 266
Absolute Maximum Ratings ...................................... 263
Thermal Operating Conditions .................................. 265
Thermal Packaging ................................................... 265
V/F Graph (Extended Temperature) ......................... 264
V/F Graph (Industrial) ............................................... 264
A/D Conversion Clock Period ................................... 227
Baud Rate Reload Calculation .................................. 177
Calculating the PWM Period ..................................... 159
Calculation for Maximum PWM Resolution............... 159
Relationship Between Device and SPI
UART Baud Rate with BRGH = 0 ............................. 184
UART Baud Rate with BRGH = 1 ............................. 184
Baud Rate Error Calculation (BRGH = 0) ................. 184
Data .................................................................. 214
Polynomial ........................................................ 214
Clock Speed...................................................... 174
PD
) .......... 272
F
Flash Configuration Words ................................. 32, 239–244
Flash Program Memory ...................................................... 51
I
I/O Ports
I
Input Capture
Input Capture with Dedicated Timers ............................... 151
Instruction Based Power-Saving Modes........................... 111
Instruction Set
Inter-Integrated Circuit. See I
Internet Address ............................................................... 303
Interrupt Vector Table (IVT) ................................................ 65
Interrupts
J
JTAG Interface.................................................................. 250
M
Microchip Internet Web Site.............................................. 303
MPLAB ASM30 Assembler, Linker, Librarian ................... 252
MPLAB Integrated Development
MPLAB PM3 Device Programmer .................................... 254
MPLAB REAL ICE In-Circuit Emulator System ................ 253
MPLINK Object Linker/MPLIB Object Librarian ................ 252
2
C
and Table Instructions ................................................ 51
Enhanced ICSP Operation ......................................... 52
JTAG Operation.......................................................... 52
Programming Algorithm .............................................. 54
RTSP Operation ......................................................... 52
Single-Word Programming ......................................... 57
Analog Input Voltage Considerations ....................... 122
Analog Port Pins Configuration................................. 122
Input Change Notification ......................................... 123
Open-Drain Configuration......................................... 122
Parallel (PIO) ............................................................ 121
Peripheral Pin Select ................................................ 123
Pull-ups and Pull-Downs........................................... 123
Clock Rates .............................................................. 177
Communicating as Master in a Single
Reserved Addresses ................................................ 177
Setting Baud Rate When Operating as
Slave Address Masking ............................................ 177
32-Bit Mode .............................................................. 152
Operations ................................................................ 152
Synchronous and Trigger Modes.............................. 151
Deep Sleep ....................................................... 112, 119
Idle ............................................................................ 112
Sleep ........................................................................ 111
Overview................................................................... 257
Summary .................................................................. 255
Symbols Used in Opcode Descriptions .................... 256
Control and Status Registers...................................... 68
Implemented Vectors.................................................. 67
Reset Sequence ......................................................... 65
Setup and Service Procedures ................................... 99
Trap Vectors ............................................................... 66
Vector Table ............................................................... 66
Environment Software .............................................. 251
Master Environment ......................................... 175
Bus Master ....................................................... 177
2010 Microchip Technology Inc.
2
C. ...................................... 175