PIC18F97J60T-I/PT Microchip Technology, PIC18F97J60T-I/PT Datasheet - Page 452

• Manufacturer Part Number: PIC18F97J60T-I/PT
• Description: IC PIC MCU FLASH 64KX16 100TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F97J60T-I/PT

• Core Size: 8-Bit
• Program Memory Size: 128KB (64K x 16)
• Oscillator Type: Internal
• Core Processor: PIC
• Speed: 41.667MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Type: FLASH
• Ram Size: 3808 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x10b
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TFQFP
• Controller Family/series: PIC18
• No. Of I/o's: 70
• Ram Memory Size: 3808Byte
• Cpu Speed: 41.667MHz
• No. Of Timers: 5
• No. Of: RoHS Compliant
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 3808 B
• Interface Type: Display Driver, Ethernet, EUSART, I2C, MSSP, SPI
• Maximum Clock Frequency: 41.667 MHz
• Number Of Programmable I/os: 70
• Number Of Timers: 5
• Operating Supply Voltage: 2.35 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DV164136, DM183033
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 16 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC162064 - HEADER INTFC MPLABICD2 64/80/100DM163024 - BOARD DEMO PICDEM.NET 2AC164323 - MODULE SKT FOR 100TQFP
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

PIC18F97J60 FAMILY
28.2
The following sections give the technical details of the packages.
DS39762C-page 450
64-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Package Details
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
e
b
c
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
β
N
1 2 3
D
D1
L
Dimension Limits
Preliminary
E1
NOTE 2
φ
Units
A2
A1
E1
D1
L1
N
A
E
D
α
e
L
φ
c
b
β
E
A1
A
0.95
0.05
0.45
0.09
0.17
MIN
11°
11°
0°
–
MILLIMETERS
12.00 BSC
12.00 BSC
10.00 BSC
10.00 BSC
0.50 BSC
1.00 REF
L1
NOM
1.00
0.60
0.22
3.5°
12°
12°
64
–
–
–
Microchip Technology Drawing C04-085B
© 2007 Microchip Technology Inc.
MAX
1.20
1.05
0.15
0.75
0.20
0.27
13°
13°
7°
α
A2