AT91SAM7SE32-CU-999 Atmel, AT91SAM7SE32-CU-999 Datasheet - Page 14

IC MCU ARM7 32KB FLASH 144LFBGA

AT91SAM7SE32-CU-999

Manufacturer Part Number
AT91SAM7SE32-CU-999
Description
IC MCU ARM7 32KB FLASH 144LFBGA
Manufacturer
Atmel
Series
AT91SAMr
Datasheet

Specifications of AT91SAM7SE32-CU-999

Core Processor
ARM7
Core Size
16/32-Bit
Speed
55MHz
Connectivity
EBI/EMI, I²C, SPI, SSC, UART/USART, USB
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
88
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 1.95 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LFBGA
Processor Series
AT91SAMx
Core
ARM7TDMI
Data Bus Width
32 bit
Data Ram Size
8 KB
Interface Type
EBI, SPI, TWI, USART
Maximum Clock Frequency
55 MHz
Number Of Programmable I/os
88
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JTRACE-ARM-2M, KSK-AT91SAM7S-PL, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
AT91SAM-ICE, AT91-ISP, AT91SAM7SE-EK
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
For Use With
AT91SAM7SE-EK - EVAL BOARD FOR AT91SAM7SEAT91SAM-ICE - EMULATOR FOR AT91 ARM7/ARM9
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AT91SAM7SE32-CU-999
Manufacturer:
Atmel
Quantity:
10 000
5.4
14
Typical Powering Schematics
AT91SAM7SE512/256/32 Preliminary
Adequate input supply decoupling is mandatory for VDDIN in order to improve startup stability
and reduce source voltage drop. The input decoupling capacitor should be placed close to the
chip. For example, two capacitors can be used in parallel: 100 nF NPO and 4.7 µF X7R.
The AT91SAM7SE512/256/32 supports a 3.3V single supply mode. The internal regulator input
connected to the 3.3V source and its output feeds VDDCORE and the VDDPLL.
shows the power schematics to be used for USB bus-powered systems.
Figure 5-1.
• One external 470 pF (or 1 nF) NPO capacitor should be connected between VDDOUT and
• One external 2.2 µF (or 3.3 µF) X7R capacitor should be connected between VDDOUT and
GND as close to the chip as possible.
GND.
3.3V System Single Power Supply Schematic
from 4.5V (USB)
Power Source
ranges
to 18V
DC/DC Converter
3.3V
VDDFLASH
VDDIO
VDDIN
VDDOUT
VDDCORE
VDDPLL
Regulator
Voltage
6222ES–ATARM–15-Dec-09
Figure 5-1

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