DSPIC33FJ256GP710A-E/PF Microchip Technology, DSPIC33FJ256GP710A-E/PF Datasheet - Page 272
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
DSPIC33FJ256GP710A-E/PF
Manufacturer Part Number
DSPIC33FJ256GP710A-E/PF
Description
IC DSPIC DSC 256K FLASH 100TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.DSPIC33FJ64GP206-IPT.pdf
(322 pages)
2.DSPIC33FJ64GP206A-IMR.pdf
(338 pages)
3.DSPIC33FJ128GP306A-IPT.pdf
(350 pages)
Specifications of DSPIC33FJ256GP710A-E/PF
Program Memory Type
FLASH
Program Memory Size
256KB (256K x 8)
Package / Case
100-TQFP
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
85
Ram Size
30K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 32x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC33F
Core
dsPIC
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
85
Data Ram Size
30 KB
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DM240002, DM330011, DM300019, DV164033, MA330011, MA330012, DM300024
Minimum Operating Temperature
- 40 C
Package
100TQFP
Device Core
dsPIC
Family Name
dSPIC33
Maximum Speed
40 MHz
Operating Supply Voltage
3.3 V
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
64-chx10-bit|64-chx12-bit
Number Of Timers
9
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ256GP710A-E/PF
Manufacturer:
Microchip Technology
Quantity:
135
Company:
Part Number:
DSPIC33FJ256GP710A-E/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
- DSPIC33FJ64GP206-IPT PDF datasheet
- DSPIC33FJ64GP206A-IMR PDF datasheet #2
- DSPIC33FJ128GP306A-IPT PDF datasheet #3
- Current page: 272 of 350
- Download datasheet (6Mb)
dsPIC33FJXXXGPX06A/X08A/X10A
25.1
TABLE 25-1:
TABLE 25-2:
TABLE 25-3:
DS70593C-page 272
DC5
dsPIC33FJXXXGPX06A/X08A/X10A
Extended Temperature Devices
Power Dissipation:
Internal chip power dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 100-pin TQFP (14x14x1 mm)
Package Thermal Resistance, 100-pin TQFP (12x12x1 mm)
Package Thermal Resistance, 80-pin TQFP (12x12x1 mm)
Package Thermal Resistance, 64-pin TQFP (10x10x1 mm)
Package Thermal Resistance, 64-pin QFN (9x9x0.9 mm)
Note 1:
Characteristic
Operating Junction Temperature Range
DC Characteristics
P
I/O = Σ ({V
Operating Ambient Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
INT
Junction to ambient thermal resistance, Theta-
= V
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DD
x (I
- V
V
DD
(in Volts)
DD
3.0-3.6V
3.0-3.6V
OH
Characteristic
- Σ I
Range
} x I
Rating
OH
OH
)
) + Σ (V
OL
x I
OL
)
-40°C to +125°C
-40°C to +85°C
Temp Range
(in °C)
JA
(
θ
JA
) numbers are achieved by package simulations.
Symbol
Symbol
P
DMAX
θ
θ
θ
θ
θ
P
T
T
T
T
JA
JA
JA
JA
JA
A
A
D
J
J
dsPIC33FJXXXGPX06A/X08A/X10A
Min
Typ
-40
-40
-40
-40
40
40
40
40
28
(T
© 2011 Microchip Technology Inc.
P
INT
J
- T
Max
Typ
Max MIPS
—
—
—
—
—
—
—
—
—
+ P
A
)/θ
40
40
I
/
JA
O
°C/W
°C/W
°C/W
°C/W
°C/W
+125
+150
+125
Max
Unit
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
1
1
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