DSPIC33FJ256GP710A-E/PF Microchip Technology, DSPIC33FJ256GP710A-E/PF Datasheet - Page 323
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DSPIC33FJ256GP710A-E/PF
Manufacturer Part Number
DSPIC33FJ256GP710A-E/PF
Description
IC DSPIC DSC 256K FLASH 100TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.DSPIC33FJ64GP206-IPT.pdf
(322 pages)
2.DSPIC33FJ64GP206A-IMR.pdf
(338 pages)
3.DSPIC33FJ128GP306A-IPT.pdf
(350 pages)
Specifications of DSPIC33FJ256GP710A-E/PF
Program Memory Type
FLASH
Program Memory Size
256KB (256K x 8)
Package / Case
100-TQFP
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
85
Ram Size
30K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 32x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC33F
Core
dsPIC
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
85
Data Ram Size
30 KB
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DM240002, DM330011, DM300019, DV164033, MA330011, MA330012, DM300024
Minimum Operating Temperature
- 40 C
Package
100TQFP
Device Core
dsPIC
Family Name
dSPIC33
Maximum Speed
40 MHz
Operating Supply Voltage
3.3 V
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
64-chx10-bit|64-chx12-bit
Number Of Timers
9
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ256GP710A-E/PF
Manufacturer:
Microchip Technology
Quantity:
135
Company:
Part Number:
DSPIC33FJ256GP710A-E/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
- DSPIC33FJ64GP206-IPT PDF datasheet
- DSPIC33FJ64GP206A-IMR PDF datasheet #2
- DSPIC33FJ128GP306A-IPT PDF datasheet #3
- Current page: 323 of 350
- Download datasheet (6Mb)
TABLE 26-10: INTERNAL LPRC ACCURACY
TABLE 26-11: SPIx MASTER MODE (CKE = 0) TIMING REQUIREMENTS
TABLE 26-12: SPIx MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS
© 2011 Microchip Technology Inc.
CHARACTERISTICS
HSP35
HSP36
HSP40
HSP41
Note 1:
HF21
Note 1:
HSP35
HSP40
HSP41
Note 1:
CHARACTERISTICS
CHARACTERISTICS
Param
Param
No.
No.
2:
Param
AC
No.
AC
AC
TscH2doV,
TscL2doV
TdoV2sc,
TdoV2scL
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
These parameters are characterized but not tested in manufacturing.
Change of LPRC frequency as V
Characterized but not tested.
These parameters are characterized but not tested in manufacturing.
TscH2doV,
TscL2doV
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
Symbol
Symbol
SDOx Data Output Valid after
SCKx Edge
SDOx Data Output Setup to
First SCKx Edge
Setup Time of SDIx Data Input
to SCKx Edge
Hold Time of SDIx Data Input
to SCKx Edge
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature
SDOx Data Output Valid after
SCKx Edge
Setup Time of SDIx Data Input
to SCKx Edge
Hold Time of SDIx Data Input
to SCKx Edge
LPRC @ 32.768 kHz
LPRC
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature
Standard Operating Conditions: 3.0V to 3.6V (unless otherwise stated)
Operating temperature
dsPIC33FJXXXGPX06A/X08A/X10A
Characteristic
Characteristic
Characteristic
DD
(1)
(1)
(1)
changes.
-40°C ≤ T
-40°C ≤ T
-40°C ≤ T
-70
Min
(2)
A
A
Min
A
Min
≤ +150°C for High Temperature
35
28
35
—
28
35
—
Typ
≤ +150°C for High Temperature
—
≤ +150°C for High Temperature
+70
Typ
Typ
10
10
Max
—
—
—
—
—
(2)
Max
Max
Units
25
25
—
—
—
—
—
%
Units
Units
-40°C ≤ T
ns
ns
ns
ns
ns
ns
ns
A
Conditions
≤ +150°C
DS70593C-page 323
Conditions
Conditions
—
—
—
—
—
—
—
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