DSPIC30F6015-20E/PT Microchip Technology, DSPIC30F6015-20E/PT Datasheet - Page 59
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DSPIC30F6015-20E/PT
Manufacturer Part Number
DSPIC30F6015-20E/PT
Description
IC DSPIC MCU/DSP 144K 64TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(66 pages)
2.DSPIC30F2011-20IP.pdf
(26 pages)
3.DSPIC30F6015-30IPT.pdf
(232 pages)
4.DSPIC30F6015-30IPT.pdf
(14 pages)
5.DSPIC30F6015-30IPT.pdf
(12 pages)
6.DSPIC30F6015-30IPT.pdf
(18 pages)
Specifications of DSPIC30F6015-20E/PT
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
52
Program Memory Size
144KB (48K x 24)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
64-TFQFP
Core Frequency
40MHz
Core Supply Voltage
5.5V
Embedded Interface Type
I2C, SPI, UART
No. Of I/o's
52
Flash Memory Size
144KB
Supply Voltage Range
2.5V To 5.5V
Package
64TQFP
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
20 MHz
Operating Supply Voltage
3.3|5 V
Data Bus Width
16 Bit
Number Of Programmable I/os
52
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
16-chx10-bit
Number Of Timers
5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164315 - MODULE SKT MPLAB PM3 44TQFPAC30F008 - MODULE SKT FOR DSPIC30F 64TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F6015-20E/PT
Manufacturer:
MICROCHIP
Quantity:
1 143
Company:
Part Number:
DSPIC30F6015-20E/PT
Manufacturer:
Microchip Technology
Quantity:
135
Company:
Part Number:
DSPIC30F6015-20E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F6015-20E/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
TABLE 13-1:
© 2010 Microchip Technology Inc.
AC/DC CHARACTERISTICS
P9b
P10
P11
P12a
P12b
P13a
P13b
Param.
No.
T
T
T
T
T
T
T
ERA
ERA
DLY
DLY
DLY
PROG
PROG
Sym
5
6
7
AC/DC CHARACTERISTICS (CONTINUED)
Delay between PGD ↓ by programming
executive to PGD released by
programming executive
Delay between PGD released by
programming executive to first PGC ↑ of
response
Delay between clocking out response
words
Row Programming cycle time
Row Programming cycle time
Bulk/Row Erase cycle time
Bulk/Row Erase cycle time
Characteristic
Standard Operating Conditions
(unless otherwise stated)
Operating Temperature: 25° C is recommended
Min
0.8
0.8
15
10
5
1
1
Max
2.6
2.6
—
—
—
4
4
Units
ms
ms
ms
ms
μs
μs
μs
DS70102K-page 59
ICSP mode
Enhanced
ICSP mode
ICSP mode
Enhanced
ICSP mode
Conditions
—
—
—