PIC18F8722-E/PT Microchip Technology, PIC18F8722-E/PT Datasheet - Page 431

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PIC18F8722-E/PT

Manufacturer Part Number
PIC18F8722-E/PT
Description
IC PIC MCU FLASH 64KX16 80TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F8722-E/PT

Core Size
8-Bit
Program Memory Size
128KB (64K x 16)
Oscillator Type
Internal
Core Processor
PIC
Speed
25MHz
Connectivity
EBI/EMI, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
70
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 16x10b
Operating Temperature
-40°C ~ 125°C
Package / Case
80-TFQFP
Controller Family/series
PIC18
No. Of I/o's
70
Eeprom Memory Size
1024Byte
Ram Memory Size
3936Byte
Cpu Speed
40MHz
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3936 B
Interface Type
SPI, I2C, EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
70
Number Of Timers
5
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM183032, DM183022, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DV164136 - DEVELOPMENT KIT FOR PIC18XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164320 - MODULE SKT MPLAB PM3 80TQFPAC174011 - MODULE SKT PROMATEII 80TQFP
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F8722-E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
APPENDIX E:
A detailed discussion of the differences between the
mid-range MCU devices (i.e., PIC16CXXX) and the
enhanced devices (i.e., PIC18FXXX) is provided in
AN716, “Migrating Designs from PIC16C74A/74B to
PIC18C442”. The changes discussed, while device
specific, are generally applicable to all mid-range to
enhanced device migrations.
This Application Note is available on our web site,
www.microchip.com, as Literature Number DS00716.
 2004 Microchip Technology Inc.
MIGRATION FROM
MID-RANGE TO
ENHANCED DEVICES
Preliminary
APPENDIX F:
A detailed discussion of the migration pathway and
differences between the high-end MCU devices (i.e.,
PIC17CXXX)
PIC18FXXX) is provided in AN726, “PIC17CXXX to
PIC18CXXX Migration”.
This Application Note is available on our web site,
www.microchip.com, as Literature Number DS00726.
PIC18F8722 FAMILY
and
the
MIGRATION FROM
HIGH-END TO
ENHANCED DEVICES
enhanced
DS39646B-page 429
devices
(i.e.,

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