ATMEGA640V-8AU Atmel, ATMEGA640V-8AU Datasheet - Page 4

IC MCU AVR 64K FLASH 100-TQFP

ATMEGA640V-8AU

Manufacturer Part Number
ATMEGA640V-8AU
Description
IC MCU AVR 64K FLASH 100-TQFP
Manufacturer
Atmel
Series
AVR® ATmegar
Datasheets

Specifications of ATMEGA640V-8AU

Core Processor
AVR
Core Size
8-Bit
Speed
8MHz
Connectivity
EBI/EMI, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
86
Program Memory Size
64KB (32K x 16)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Processor Series
ATMEGA64x
Core
AVR8
Data Bus Width
8 bit
Data Ram Size
8 KB
Interface Type
2-Wire, JTAG, SPI
Maximum Clock Frequency
16 MHz
Number Of Programmable I/os
86
Number Of Timers
8
Operating Supply Voltage
1.8 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
Controller Family/series
AVR MEGA
No. Of I/o's
86
Eeprom Memory Size
4KB
Ram Memory Size
8KB
Cpu Speed
8MHz
Rohs Compliant
Yes
For Use With
ATSTK600-TQFP100 - STK600 SOCKET/ADAPTER 100-TQFP770-1007 - ISP 4PORT ATMEL AVR MCU SPI/JTAG770-1005 - ISP 4PORT FOR ATMEL AVR MCU JTAG770-1004 - ISP 4PORT FOR ATMEL AVR MCU SPIATAVRISP2 - PROGRAMMER AVR IN SYSTEMATSTK503 - STARTER KIT AVR EXP MODULE 100P
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ATMEGA640V-8AU
Manufacturer:
PHILIPS
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Part Number:
ATMEGA640V-8AU
Manufacturer:
Atmel
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Part Number:
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Figure 1-3.
2549MS–AVR–09/10
(RXD0/ PCINT8 /PDI) PE0
(ICP3/ CLKO /INT7) PE7
(OC2A/ PCINT4 ) PB4
(MOSI/ PCINT2 ) PB2
(MISO/ PCINT3 ) PB3
(OC1A/ PCINT5 ) PB5
(OC1B/ PCINT6 ) PB6
(SCK/ PCINT1 ) PB1
(OC3A/AIN1) PE3
(OC3C/INT5) PE5
(SS/ PCINT0 ) PB0
(OC3B/INT4) PE4
(XCK0/AIN0) PE2
(TXD0/PDO) PE1
(T3/INT6) PE6
Pinout ATmega1281/2561
(OC0B) PG5
Note:
10
11
12
13
14
15
16
1
2
3
4
5
6
7
8
9
The large center pad underneath the QFN/MLF package is made of metal and internally con-
nected to GND. It should be soldered or glued to the board to ensure good mechanical stability. If
the center pad is left unconnected, the package might loosen from the board.
INDEX CORNER
ATmega640/1280/1281/2560/2561
ATmega1281/2561
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
PA3 (AD3)
PA4 (AD4)
PA5 (AD5)
PA6 (AD6)
PA7 (AD7)
PG2 (ALE)
PC7 (A15 )
PC6 (A14)
PC5 (A13)
PC4 (A12)
PC3 (A11)
PC2 (A10)
PC1 (A9)
PC0 (A8)
PG1 (RD)
PG0 (WR)
4

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