LPC2478FET208,551 NXP Semiconductors, LPC2478FET208,551 Datasheet - Page 3
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LPC2478FET208,551
Manufacturer Part Number
LPC2478FET208,551
Description
IC ARM7 MCU 512K LCD 208-TFBGA
Manufacturer
NXP Semiconductors
Series
LPC2400r
Specifications of LPC2478FET208,551
Program Memory Type
FLASH
Program Memory Size
512KB (512K x 8)
Package / Case
208-TFBGA
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
160
Ram Size
96K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC24
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
98 KB
Interface Type
CAN/I2C/I2S/IrDA/SPI/SSP/UART/USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
160
Number Of Timers
4
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, DK-35TS-LPC2478, DK-57TS-LPC2478, DK-57VTS-LPC2478, SOMDIMM-LPC2478, SAB-TFBGA208, KSK-LPC2478-JL, MCB2470
Development Tools By Supplier
OM11015, OM11019, OM11022
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Package
208TFBGA
Device Core
ARM7TDMI-S
Family Name
LPC2000
Maximum Speed
72 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
622-1034 - PROGRAMMERS, DEVELOPMENT SYSTEMS622-1033 - KIT LCD TOUCH 5.7" FOR LPC2478MCB2470 - BOARD EVAL NXP LPC247X SERIESOM11022 - EVAL LPC-STICK WITH LPC2478OM11019 - BOARD EVAL FOR LPC2478568-4742 - MODULE DIMM LPC2478 ARM7568-4741 - KIT LCD TOUCH 5.7" FOR LPC2478622-1028 - KIT LCD TOUCH 5.7" FOR LPC2478KSDKLPC2478-PL - KIT IAR KICKSTART NXP LPC2478622-1024 - BOARD SCKT ADAPTER FOR TFBGA208568-4369 - BOARD EVAL FOR LPC2478622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4364
935284072551
LPC2478FET208-S
935284072551
LPC2478FET208-S
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC2478FET208,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
1. Product identification
2. Errata overview
Table 2.
Table 3.
Table 4.
ES_LPC2478
Errata sheet
Functional
problems
Ethernet.1
Core.1
ADC.1
AC/DC
deviations
IRC.1
IRC.2
Errata notes
Note.1
Functional problems table
AC/DC deviations table
Errata notes table
Short description
Ethernet TxConsumeIndex register does not update
correctly after the first frame is sent
Incorrect update of the Abort Link register in Thumb
state
External sync inputs not operational
Short description
Accuracy of the Internal RC oscillator (IRC) frequency
may be outside of the 4 MHz +/- 1 % specification only
at extreme temperatures.
Accuracy of the internal RC oscillator (IRC) frequency
for devices only with date codes 0949 and before are
outside of spec between 20 C and 40 C
Short description
When the input voltage is Vi V
of the following port pins P0.23, P0.24. P0.25, P0.26,
P1.30, P1.31, P0.12, and P0.13 (configured as general
purpose input pin (s)), current must be limited to less
than 4 mA by using a series limiting resistor.
The LPC2478 devices typically have the following top-side marking:
The last/second to last letter in the third line (field ‘R’) will identify the device revision. This
Errata Sheet covers the following revisions of the LPC2478:
Table 1.
Field ‘YY’ states the year the device was manufactured. Field ‘WW’ states the week the
device was manufactured during that year.
Revision identifier (R)
‘C’
‘D’
LPC2478xxx
xxxxxxx
xxYYWWR[x]
Device revision table
All information provided in this document is subject to legal disclaimers.
DD
Rev. 6 — 1 March 2011
I/O + 0.5 V on each
Revision description
Initial device revision
Second device revision
Revision identifier
‘C’, ‘D’
‘C’, ‘D’
‘C’, ‘D’
Revision identifier
‘C’
‘D’
Revision identifier
‘C’, ‘D’
ES_LPC2478
Errata sheet LPC2478
Detailed description
Section 3.1 on page 4
Section 3.2 on page 5
Section 3.3 on page 6
Detailed description
Section 4.1 on page 7
Section 4.2 on page 8
Detailed description
Section 5.1 on page 8
© NXP B.V. 2011. All rights reserved.
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