LPC2478FET208,551 NXP Semiconductors, LPC2478FET208,551 Datasheet - Page 3

• Manufacturer Part Number: LPC2478FET208,551
• Description: IC ARM7 MCU 512K LCD 208-TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC2400r

Specifications of LPC2478FET208,551

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 208-TFBGA
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 160
• Ram Size: 96K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC24
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 98 KB
• Interface Type: CAN/I2C/I2S/IrDA/SPI/SSP/UART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 160
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, DK-35TS-LPC2478, DK-57TS-LPC2478, DK-57VTS-LPC2478, SOMDIMM-LPC2478, SAB-TFBGA208, KSK-LPC2478-JL, MCB2470
• Development Tools By Supplier: OM11015, OM11019, OM11022
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Package: 208TFBGA
• Device Core: ARM7TDMI-S
• Family Name: LPC2000
• Maximum Speed: 72 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 622-1034 - PROGRAMMERS, DEVELOPMENT SYSTEMS622-1033 - KIT LCD TOUCH 5.7" FOR LPC2478MCB2470 - BOARD EVAL NXP LPC247X SERIESOM11022 - EVAL LPC-STICK WITH LPC2478OM11019 - BOARD EVAL FOR LPC2478568-4742 - MODULE DIMM LPC2478 ARM7568-4741 - KIT LCD TOUCH 5.7" FOR LPC2478622-1028 - KIT LCD TOUCH 5.7" FOR LPC2478KSDKLPC2478-PL - KIT IAR KICKSTART NXP LPC2478622-1024 - BOARD SCKT ADAPTER FOR TFBGA208568-4369 - BOARD EVAL FOR LPC2478622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4364; 935284072551; LPC2478FET208-S

NXP Semiconductors
1. Product identification
2. Errata overview
Table 2.
Table 3.
Table 4.
ES_LPC2478
Errata sheet
Functional
problems
Ethernet.1
Core.1
ADC.1
AC/DC
deviations
IRC.1
IRC.2
Errata notes
Note.1
Functional problems table
AC/DC deviations table
Errata notes table
Short description
Ethernet TxConsumeIndex register does not update
correctly after the first frame is sent
Incorrect update of the Abort Link register in Thumb
state
External sync inputs not operational
Short description
Accuracy of the Internal RC oscillator (IRC) frequency
may be outside of the 4 MHz +/- 1 % specification only
at extreme temperatures.
Accuracy of the internal RC oscillator (IRC) frequency
for devices only with date codes 0949 and before are
outside of spec between 20 C and 40 C
Short description
When the input voltage is Vi  V
of the following port pins P0.23, P0.24. P0.25, P0.26,
P1.30, P1.31, P0.12, and P0.13 (configured as general
purpose input pin (s)), current must be limited to less
than 4 mA by using a series limiting resistor.
The LPC2478 devices typically have the following top-side marking:
The last/second to last letter in the third line (field ‘R’) will identify the device revision. This
Errata Sheet covers the following revisions of the LPC2478:
Table 1.
Field ‘YY’ states the year the device was manufactured. Field ‘WW’ states the week the
device was manufactured during that year.
Revision identifier (R)
‘C’
‘D’
LPC2478xxx
xxxxxxx
xxYYWWR[x]
Device revision table
All information provided in this document is subject to legal disclaimers.
DD
Rev. 6 — 1 March 2011
I/O + 0.5 V on each
Revision description
Initial device revision
Second device revision
Revision identifier
‘C’, ‘D’
‘C’, ‘D’
‘C’, ‘D’
Revision identifier
‘C’
‘D’
Revision identifier
‘C’, ‘D’
ES_LPC2478
Errata sheet LPC2478
Detailed description
Section 3.1 on page 4
Section 3.2 on page 5
Section 3.3 on page 6
Detailed description
Section 4.1 on page 7
Section 4.2 on page 8
Detailed description
Section 5.1 on page 8
© NXP B.V. 2011. All rights reserved.
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